Optical fiber array connecting device and manufacturing method thereof

Abstract

The invention discloses an optical fiber array connecting device and a manufacturing method thereof. The connecting device comprises an optical fiber connector and an optical fiber array, the optical fiber array comprises a plurality of optical fibers which are arranged in order, each optical fiber is tightly attached to the optical fibers around the optical fiber in the mode that the outer surfaces of the optical fibers are tangent, and the two ends or any one end of the optical fiber array is arranged in the optical fiber connector, and the overall shape of the optical fiber array is bound and positioned by the inner surface of the optical fiber connector; a positioning structure is arranged on the optical fiber connector and is used for being matched with a corresponding positioning structure on an interface of to-be-connected equipment; the positioning structure and the arrangement of the optical fibers have a determined position relationship so as to maintain the overall position of the optical fiber array relative to the interface of the to-be-connected equipment, and light emitted by the to-be-connected equipment can be coupled into the optical fibers. According to the invention, the optical fiber array with high-density optical fiber distribution can be realized with a small size.

Description

technical field [0001] The invention relates to an optical communication device, in particular to an optical fiber array connection device and a manufacturing method thereof. Background technique [0002] With the continuous reduction of transistor feature size, electrical interconnection faces limitations such as large signal delay, small transmission bandwidth, large signal crosstalk, high power consumption, difficult processing, and high cost, and the speed of increasing integration slows down or even stagnates. [0003] The structure of metal interconnection in the current circuit is becoming more and more complex, and interconnection technology is developing towards high-speed and high-density integration to meet the current needs of large-capacity and high-speed transmission. With the continuous reduction of transistor feature size Small, electrical interconnection faces limitations such as large signal delay, small transmission bandwidth, large signal crosstalk, high ...

AI Technical Summary

Problems solved by technology

However, the use of V-groove makes the optical connection interface too large, and the fiber density cannot meet the requirements of optical connection.

For example, the size of the current micro-LED can reach 2um*2um, but the size of the V-groove itself and the spacing requirements between the V-grooves are difficult to meet the size and the number of optical fibers required for the connection between chips.

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