Linkage recovery method and system based on wafer test equipment and MES system

Abstract

The invention provides a linkage recovery method based on wafer test equipment and an MES system, and the method specifically comprises the following steps: S1, generating test data through a test wafer, collecting the test data through the MES system, converting the test data into Map, and uploading the Map to a Map server; s2, removing the local Map backup of the tested wafer stored in a test machine; s3, judging the tested wafer according to the test data in a man-machine combination mode through the MES system, and sending a recovery instruction to the wafer needing to be recovered and retested; s4, downloading the Map of the wafer which needs to be recycled and retested from the Map server to the test machine; and S5, recovering the wafer needing to be recovered and retested according to the Map. According to the invention, the wafer test equipment composed of the test machine and the probe station is linked with the MES system, so that the MES system can effectively control the recovery behavior of the test equipment, the recovery process is optimized, the accuracy of wafer recovery and retest is improved, and the wafer production efficiency is improved.

Description

technical field [0001] The invention relates to a method and system for testing and recycling integrated circuits, in particular to a method and system for linked recycling based on wafer testing equipment and an MES system. Background technique [0002] During the whole process of design and manufacture of integrated circuits and packaging applications, integrated circuit testing is an important part of it. Integrated circuit testing mainly includes wafer testing (CP), finished product testing (FT) and reliability testing, and CP testing is the core step of chip design and manufacturing. [0003] The CP test is carried out by the testing machine (ATE) and the probe station (Prober). The wafers completed by the CP test will have a corresponding Map, which records the size, step distance, natural properties and result properties of the wafer product. In the CP test, the failure of the initial test does not mean that the failure rate of the wafer is 100%, and there may be mis...

AI Technical Summary

Problems solved by technology

[0004] At present, it all depends on the recycling method of the probe station. During the recycling process of this method, the map of the wafer needs to be called from the local and the server, that is, the local map is called first. If the local map is not called from the server, the calling speed is slow. , the efficiency is low, and the testing process may change the test machine for testing. The local Map is not necessarily the latest Map, and there is a certain error rate in the direct call, thereby reducing the efficiency of the entire CP test, unable to control the recycling process, and improving the quality of the wafer. Cost of production

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