High-shielding-property black matte heat-conducting polyimide film and preparation method thereof

Abstract

The invention discloses a high-shielding-property black matte heat-conducting polyimide film and a preparation method thereof, and aims to solve the problems that the electric breakdown strength of a PI (polyimide) film can be reduced while the light shielding property is improved in the manufacturing of the existing black polyimide film, and in addition, the comprehensive performance is low due to the fact that polyacrylonitrile and polyamide acid are relatively high in viscosity and molecular-level dispersion is difficult to achieve in the prior art. Diamond powder, carbon black, matting powder, polyacrylonitrile and boron nitride are uniformly distributed in the polyimide film, and the preparation method roughly comprises the following steps: uniformly dispersing the diamond powder, the carbon black and the matting powder in an organic solvent, adding polyacrylonitrile, stirring, grinding, adding a diamine monomer, boron nitride and a dianhydride monomer, uniformly stirring to obtain a polyamide acid solution, and carrying out vacuum defoaming treatment, extruding and salivating to form a liquid film, heating and imidizing, and biaxially stretching to obtain the high-shielding-property black matte heat-conducting polyimide film.

Description

technical field [0001] The invention belongs to the technical field of novel electronic information material functional polyimide film among polymer materials, and specifically belongs to a high-shielding black matte heat-conducting polyimide film and a preparation method thereof. Background technique [0002] At present, polyimide (PI) film is widely used in the field of electronics industry. It is widely used as base film or cover film material in flexible printed circuit board (FPC). Because the surface gloss of traditional PI film is high and transparent In the application process, because of its high gloss, there will be glare or astigmatism effect on the appearance of the product due to light reflection, and because of high transparency, the circuit design distribution will be easy to interpret, and it will be easily known by the technical staff of the same industry and Cracking, and it will also cause the line to be susceptible to light transmission and cause copper o...

AI Technical Summary

Problems solved by technology

Under the existing technology, for the manufacturing principle of black polyimide film with low light transmittance, low gloss, high thermal conductivity, high insulation, high stability and good mechanical properties, mainly through the PI film polymer polyamic acid solution Diamond powder, carbon black, matting powder, polyacrylonitrile and boron nitride are mixed in; however, carbon black also reduces the electrical breakdown strength of PI film while improving the black light-shielding property, and the dispersion of carbon black is poor ;In addition, polyacrylonitrile and polyamic acid are stirred and blended, because the respective viscosity of the two is relatively high, so it is difficult to realize the dispersion at the molecular level, and the uneven dispersion of the two leads to low comprehensive performance.

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