Copper sheet surface treatment method

A technology of surface treatment and copper sheet, which is applied in the field of DCB substrate preparation, can solve the problems of insufficient reliability of finished product quality, low efficiency of copper surface roughening, and influence on post-process stability, and achieve the effect of improving wettability

Active Publication Date: 2021-12-17
江苏富乐华半导体科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the manufacturing process of multi-layer printed circuit boards, the requirements for precision and multi-functionality have been significantly improved, and the improvement of the adhesion between the inner layer copper sheet and the resin material is a hot topic of research; Bonding, copper layer and dry film bonding, ink solder resist and other processes have important influences; commonly used methods for roughening the surface of copper sheets include two chemical oxidation processes: blackening and browning; after blackening, The copper oxide layer grown on the base copper will form a dendritic structure, which is beneficial to promote the combination of the copper layer and the prepreg; after the browning treatment, the copper sheet will form a moderately deep micro-rough structure, which is in close contact with the resin and has a good Thermal stability and corrosion resistance; because the black oxidation method based on the alkaline system is inconvenient to operate, the relatively safe and easy-to-handle brown oxidation method is gradually replaced by the black oxidation method, but the brown oxidation method also has a roughening effect on the surface of the copper sheet Low quality and insufficient reliability of finished products, and the degree of roughness of the surface of the copper sheet and the uniformity of the roughness of the surface of the copper sheet are not easy to control
[0003] In order to remove defects (impurities, oil stains, stains, oxidation) on the surface of the copper sheet (raw material) and to form a certain roughness on the surface of the copper sheet, it is necessary to clean the copper sheet. The process in the industry generally uses a microetching solution ( Sulfuric acid + sodium persulfate system) to clean the copper sheet, but because the existing copper sheet cannot guarantee the flatness of the copper sheet surface during the manufacturing process (calendering process), grooves will be formed on the copper sheet, using sulfuric acid + persulfate system) The liquid medicine system of sodium sulfate cannot eliminate this defect, which will affect the stability of the subsequent process (oxidation, sintering)

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] S1: Put the copper sheet into the micro-etching solution, and check it after overflow washing. The micro-etching solution is prepared by mixing sulfuric acid and sodium persulfate, the concentration of the sulfuric acid is 0.2mol / L, and the sodium persulfate The mass concentration in the microetching solution is 2%;

[0040] S2: configure emery suspension, the emery purity in the emery suspension is 99%, and the emery is 220#;

[0041] S3: Spray the prepared emery suspension onto the surface of the copper sheet, the injection pressure is 1 bar, and the conveying speed of the copper sheet during the spraying is 1m / min;

[0042]S4: The copper sheet after sandblasting is sequentially washed by overflow water, pressurized water, ultrasonic water, and twice pressurized water, then cooled to 18° C., and dried to obtain the treated copper sheet.

Embodiment 2

[0044] S1: Put the copper sheet into the micro-etching solution, and check it after overflow washing. The micro-etching solution is prepared by mixing sulfuric acid and sodium persulfate, the concentration of the sulfuric acid is 1mol / L, and the sodium persulfate is The mass concentration in the microetching solution is 3%;

[0045] S2: configure emery suspension, the emery purity in the emery suspension is 99.2%, and the emery is 240#;

[0046] S3: Spray the prepared emery suspension onto the surface of the copper sheet, the injection pressure is 1.5bar, and the conveying speed of the copper sheet during the spraying is 1.2m / min;

[0047] S4: The copper sheet after sand blasting is sequentially washed by overflow water, pressurized water, ultrasonic water, and twice pressurized water, then cooled to 19° C., and dried to obtain the treated copper sheet.

Embodiment 3

[0049] S1: Put the copper sheet into the microetching solution, and check it after overflow washing. The microetching solution is prepared by mixing sulfuric acid and sodium persulfate. The concentration of the sulfuric acid is 2mol / L, and the sodium persulfate is The mass concentration in the microetching solution is 6%;

[0050] S2: configure emery suspension, the emery purity in the emery suspension is 99.3%, and the emery is 250#;

[0051] S3: Spray the prepared emery suspension onto the surface of the copper sheet, the injection pressure is 1.6bar, and the conveying speed of the copper sheet during the spraying is 1.4m / min;

[0052] S4: The copper sheet after sandblasting is sequentially washed by overflow water, pressurized water, ultrasonic water, and twice pressurized water, then cooled to 18-25° C., and dried to obtain the treated copper sheet.

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Abstract

The invention provides a copper sheet surface treatment method, which is characterized in that a sand blasting process is used for treating a copper sheet, and carborundum suspension is sprayed to a copper surface at a high speed so as to change the surface appearance of the copper surface and eliminate stripe-shaped defects of the copper sheet in a machining process; when the copper surface defects (impurities, oil stains, stains and oxidation) are removed, certain roughness can be formed on the surface of the copper sheet, a certain surface area is increased for the subsequent process (copper sheet oxidation), and the wettability of DCB sintering is improved; then, nanometer copper coated with the titanium dioxide and the copper sheet subjected to sand blasting are connected in a physical melting mode through laser, a first-stage coarse structure obtained after sand blasting treatment of the copper sheet is modified and optimized to form a third-stage micro-nano structure, the surface roughness of the copper sheet can be adjusted and controlled, and the surface roughness of the copper sheet is made to be uniform; and the nano-copper coated with the titanium dioxide and the micropore structure on the copper sheet synergistically improve the anti-rust hydrophobicity of the copper sheet, so that the service life of the copper sheet is prolonged.

Description

technical field [0001] The invention relates to the technical field of DCB substrate preparation, in particular to a copper sheet surface treatment method. Background technique [0002] In the manufacturing process of multi-layer printed circuit boards, the requirements for precision and multi-functionality have been significantly improved, and the improvement of the adhesion between the inner layer copper sheet and the resin material is a hot topic of research; Bonding, copper layer and dry film bonding, ink solder resist and other processes have important influences; commonly used methods for roughening the surface of copper sheets include two chemical oxidation processes: blackening and browning; after blackening, The copper oxide layer grown on the base copper will form a dendritic structure, which is beneficial to promote the combination of the copper layer and the prepreg; after the browning treatment, the copper sheet will form a moderately deep micro-rough structure,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24C1/08B24C7/00C23G1/10
CPCB24C1/086B24C7/0023C23G1/103
Inventor 蔡俊贺贤汉李炎马敬伟
Owner 江苏富乐华半导体科技股份有限公司
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