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Sapphire chemical mechanical polishing liquid and its application

A chemical mechanical and polishing liquid technology, which is applied in the direction of polishing compositions containing abrasives, grinding machine tools, metal processing equipment, etc., can solve the problems of poor storage stability, unsuitable cleaning process, and low polishing efficiency, so as to reduce crystallization and improve The effect of high polishing rate and material removal rate

Active Publication Date: 2022-07-12
万华化学集团电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In view of the above-mentioned shortcoming of the prior art, the object of the present invention is to provide a kind of sapphire chemical mechanical polishing liquid, be used to solve the low polishing efficiency of the sapphire substrate polishing liquid in the prior art, be easy to air-dry on the sapphire surface and be not suitable for follow-up Cleaning process, poor long-term storage stability, etc.

Method used

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  • Sapphire chemical mechanical polishing liquid and its application
  • Sapphire chemical mechanical polishing liquid and its application
  • Sapphire chemical mechanical polishing liquid and its application

Examples

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Effect test

preparation example Construction

[0035] Specifically, the preparation method of the sapphire chemical mechanical polishing liquid, for example, includes the following steps: taking a certain solid content of silica sol and uniformly dispersing it in a half amount (half of the required amount of deionized water in the sapphire polishing composition) deionized water In water, the solution is called A; then slowly add manganese-containing complexing agent to the other half of deionized water, stir for 5 minutes, add surfactant, stir for 5 minutes, and then add an appropriate amount of pH adjuster to make the pH value between 8- Within the range of 12, stir for 5 minutes, and the solution is called B; then slowly add solution B to solution A, and stir for 30 minutes to obtain the sapphire chemical mechanical polishing liquid composition. The appropriate amount of pH adjuster can be selected according to needs with different concentrations of pH adjuster, and on the basis of ensuring that the content of the pH adju...

Embodiment 1

[0050] Sapphire chemical mechanical polishing fluid consists of the following components:

[0051] Silica sol 40wt%, particle size 80nm; hydroxyethylethylenediamine 3wt%; polyoxyethylene ether phosphate 2wt%; EDTA manganese complex 2wt%; the balance is deionized water. Test the removal rate, roughness, upper solid content and lower solid content of the polishing liquid of this embodiment according to the polishing conditions and methods of the previous embodiment to evaluate the polishing efficiency of the polishing liquid; Test the corresponding aforementioned parameters to evaluate the stability of the polishing liquid.

Embodiment 2

[0053] Sapphire chemical mechanical polishing fluid consists of the following components:

[0054] Silica sol 35wt%, particle size 100nm; ethylenediamine 5wt%; polyoxyethylene sodium sulfate 0.5wt%; manganese citrate complex 0.3wt%; the balance is deionized water. Test the removal rate, roughness, upper solid content and lower solid content of the polishing liquid of this embodiment according to the polishing conditions and methods of the previous embodiment to evaluate the polishing efficiency of the polishing liquid; Test the corresponding aforementioned parameters to evaluate the stability of the polishing liquid.

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Abstract

The invention discloses a sapphire chemical-mechanical polishing liquid and an application thereof. The polishing liquid is composed of the following components by weight percentage: 10-50% of silica sol, 1%-10% of pH regulator, and 0.1% of surfactant. %~3%, 0.1%~5% of manganese-containing complex, and the rest is deionized water, and the pH value of the polishing liquid ranges from 8 to 12. By adding a manganese-containing complexing agent, the polishing liquid composition has the characteristics of fast polishing rate, good surface quality, easy cleaning and good storage stability.

Description

technical field [0001] The invention relates to sapphire planarization technology, in particular to a sapphire chemical mechanical polishing liquid composition and its application in the processing of sapphire wafers. Background technique [0002] Single crystal sapphire (mainly composed of α-Al 2 O 3 ), which is widely used in military, aerospace, information, optics, superconductivity and other technical fields due to its excellent mechanical properties, dielectric properties, chemical stability, thermal conductivity and high surface smoothness. Highest quality substrates and substrate materials for thin films, infrared optics, microelectronics and more. Today, whether it is the sapphire window of military high-performance infrared detectors or the substrates of GaN-based blue LEDs and laser diodes, the surface processing quality (such as surface roughness, microcracks, scratches, dislocations) and Machining accuracy has a crucial impact on the quality of material epita...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09G1/02B24B37/04
CPCC09G1/02B24B37/044
Inventor 崔晓坤卞鹏程
Owner 万华化学集团电子材料有限公司
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