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Preparation method of modified inorganic filler, modified inorganic filler and heat-conducting gel

An inorganic filler and modification technology, which is applied in the preparation of modified inorganic fillers, modified inorganic fillers and thermally conductive gels, can solve the problem of inability to carry out large-scale automatic pad operation, complex production process of over-thin gaskets, and volatile To achieve excellent lipophilic and hydrophobic properties, stable and healthy working temperature environment, and improved flexibility

Pending Publication Date: 2021-11-19
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although thermal conductive silicone grease is used in a large area now, it has problems such as not being suitable for large area application, inconvenient operation, easy aging after long-term high-temperature use, and volatility; the disadvantage of thermal conductive gaskets is that the thickness of gaskets that are too thin The production process is complicated, the cost is relatively high, and large-scale automated footing operations cannot be performed at the same time
Compared with the former two, thermal conductive gel can circumvent the above problems, but there are still cases of low flexibility

Method used

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  • Preparation method of modified inorganic filler, modified inorganic filler and heat-conducting gel
  • Preparation method of modified inorganic filler, modified inorganic filler and heat-conducting gel
  • Preparation method of modified inorganic filler, modified inorganic filler and heat-conducting gel

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preparation example Construction

[0031] see figure 1 , a flow chart of the steps for the preparation method of the modified inorganic filler provided in the embodiment of the present invention, including the following steps:

[0032] Step S110: preparing a silane hydrolyzate.

[0033] In some of these embodiments, in the step of preparing the silane hydrolyzate, the following steps are specifically included:

[0034] The silane coupling agent, deionized pure water, and alcohol solvent are mixed and stirred for hydrolysis according to the mass fraction of (0.3-0.5%): (0.3-0.5%): (0.5-4.0%) to obtain a silane hydrolyzate.

[0035] In some of these embodiments, the silane coupling agent is selected from octyltrimethoxysilane, decyltrimethoxysilane, dodecyltrimethoxysilane, hexadecyltrimethoxysilane, octadecyltrimethoxysilane, at least one of alkyltrimethoxysilanes.

[0036] In some of these embodiments, the alcoholic solvent is anhydrous methanol or ethanol solvent.

[0037] Step S120: Mix and stir the therm...

Embodiment 1

[0048] (1) Preparation of silane coupling agent hydrolyzate required for powder modification:

[0049] Mix octyltrimethoxysilane coupling agent with deionized water and anhydrous methanol at a mass ratio of 1:1:3 at room temperature at a speed of 200 rpm for about 90 minutes, until the mixed solution changes from turbid to Change to clarified and ready to use.

[0050](2) Preparation of modified filler powder:

[0051] Add a certain amount of high-purity spherical aluminum powder to the planetary machine for stirring, and drop the prepared coupling agent hydrolyzate within 5 minutes. The amount used is that the mass of the coupling agent itself accounts for 0.5% of the mass of the high-purity spherical aluminum powder about. Heat up the temperature in the planetary machine to 50°C, and continue stirring for 1 hour after the temperature is stable; then raise the temperature to 120°C, turn on the vacuum after the temperature is stable, and continue stirring for 1 hour; finally...

Embodiment 2

[0053] (1) Preparation of silane coupling agent hydrolyzate required for powder modification:

[0054] Mix decanyltrimethoxysilane with deionized water and anhydrous methanol at a mass ratio of 1:1:3 at room temperature at a speed of 200 rpm for about 60 minutes, until the mixed solution changes from turbid to clear Ready to use.

[0055] (2) Preparation of modified filler powder:

[0056] Add a certain amount of high-purity spherical alumina to the planetary machine for stirring, and drop the prepared coupling agent hydrolyzate within 5 minutes. The amount used is that the mass of the coupling agent itself accounts for 0.5% of the mass of high-purity spherical alumina about. Heat up the temperature in the planetary machine to 50°C, and continue stirring for 1 hour after the temperature is stable; then raise the temperature to 120°C, turn on the vacuum after the temperature is stable, and continue stirring for 1 hour; finally, cool to room temperature, take out the pot and s...

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Abstract

The invention provides a preparation method of a modified inorganic filler, which comprises the steps of mixing and stirring heat-conducting powder and the silane hydrolysate until a mixed solution becomes clear from turbid, heating the clear solution to 40-60 DEG C, stirring for 1-3 hours at a constant temperature to obtain a first solution, heating the first solution to 115-125 DEG C, stirring for 1-3 hours at a constant temperature in a vacuum environment, obtaining a second solution, cooling the second solution to the room temperature, and obtaining the modified inorganic filler. According to the preparation method of the modified inorganic filler, through modification of special silane, long-chain functional groups with good compatibility are grafted to the surface of the heat-conducting powder, the modified inorganic filler has more excellent oleophylic and hydrophobic performance and is more tightly combined with a resin matrix, and the flexibility of the material is improved. In addition, the invention also provides a modified inorganic filler and heat-conducting gel.

Description

technical field [0001] The invention relates to the technical field of thermal interface materials, in particular to a preparation method of a modified inorganic filler, a modified inorganic filler and a thermally conductive gel. Background technique [0002] Thermal management of electronic devices is one of the key research directions in the field of electronic equipment manufacturing. At present, electronic devices with highly integrated chip packaging technology are the development trend in this field, but because of the high density, chips and electronic devices generate a lot of heat during operation. This technical problem seriously affects the computing speed of the chip, reducing the efficiency of electronic equipment and shortening its service life. [0003] In order to solve the above problems, the industry usually uses a heat sink connected to the chip to efficiently transfer the heat generated during operation to the outer area of ​​the semiconductor package in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C1/40C09C1/04C09C1/64C09C3/12C09C3/04C09K5/14
CPCC09C1/407C09C1/40C09C1/644C09C1/043C09C3/12C09C3/04C09K5/14C01P2004/61C01P2004/62
Inventor 曾小亮马强强李俊鸿梁挺庞云嵩孙蓉许建斌
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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