High-elasticity modified epoxy seam sealing adhesive

An epoxy-sealing, high-elasticity technology, applied in the field of epoxy adhesives, can solve the problems of viscosity drop, restricted use conditions, use occasions, storage and use inconvenience, etc., to increase the surface adsorption force and improve the overall adhesive ability.

Pending Publication Date: 2021-11-16
杭州固安科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the existing sealing adhesives are fast-curing epoxy adhesives, and most epoxy adhesives are divided into one-component epoxy adhesives and two-component epoxy adhesives; among them, one-component epoxy adhesives Oxygen adhesives are widely used due to their excellent heat resistance and good elastic film-forming properties. However, due to the high curing temperature and long curing time of one-component epoxy adhesives, it is difficult to There are many inconveniences, and the viscosity will decrease when used; while the two-component epoxy adhesive has the characteristics of low-temperature rapid curing and high storage stability, and has higher application prospects, but the two-component epoxy adhesive is elastic when used. low, which limits the use conditions and occasions, so the present invention relates to a highly elastic modified epoxy sealant

Method used

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  • High-elasticity modified epoxy seam sealing adhesive
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  • High-elasticity modified epoxy seam sealing adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A highly elastic modified epoxy sealant, comprising component A and component B with a volume ratio of 2:1;

[0022] In parts by mass, component A includes 80 parts of bisphenol A type epoxy resin, 15 parts of dodecyl to myristyl glycidyl ether, 40 parts of epoxy-terminated polyurethane, 50 parts of 800 mesh silicon powder, 60 parts 2000 mesh silica powder, 5 parts of gas-phase hydrophobic silica;

[0023] In terms of parts by mass, component B includes 20 parts of polyetheramine D230, 20 parts of polyetheramine D400, 2 parts of accelerator, 20 parts of nonylphenol modified hexamethylenediamine, 2 parts of γ-glycidyl propyl trimethyl Oxysilane, 20 parts of 800-mesh silicon micropowder, 40 parts of 2000-mesh silicon micropowder, and 5 parts of gas-phase hydrophobic silica.

[0024] The preparation method of this highly elastic modified epoxy sealant is as follows:

[0025] S1. Preparation of component A: Pour the substances of component A into the stirring and dispersi...

Embodiment 2

[0029] A highly elastic modified epoxy sealant, comprising component A and component B with a volume ratio of 3:1;

[0030] In terms of parts by mass, component A includes 120 parts of bisphenol A epoxy resin, 20 parts of dodecyl to myristyl glycidyl ether, 40 parts of epoxy-terminated polyurethane, 60 parts of 800-mesh silicon micropowder, 70 parts 2000 mesh silica powder, 2 parts gas-phase hydrophobic silica;

[0031] In terms of parts by mass, component B includes 15 parts of polyetheramine D230, 15 parts of polyetheramine D400, 2 parts of accelerator, 20 parts of nonylphenol modified hexamethylenediamine, 2 parts of γ-glycidyl propyl trimethyl Oxysilane, 20 parts of 800-mesh silicon micropowder, 30 parts of 2000-mesh silicon micropowder, and 2 parts of gas-phase hydrophobic silica.

Embodiment 3

[0033] A highly elastic modified epoxy sealant, comprising component A and component B with a volume ratio of 3:1;

[0034] In terms of parts by mass, component A includes 100 parts of bisphenol A type epoxy resin, 15 parts of dodecyl to myristyl glycidyl ether, 40 parts of epoxy-terminated polyurethane, 70 parts of 800-mesh silicon micropowder, 60 parts 2000 mesh silica powder, 5 parts of gas-phase hydrophobic silica;

[0035] In parts by mass, component B includes 20 parts of polyetheramine D230, 20 parts of polyetheramine D400, 2 parts of accelerator, 20 parts of nonylphenol modified ethylenediamine, 2 parts of γ-glycidyl propyl trimethyl Oxysilane, 20 parts of 800-mesh silicon micropowder, 40 parts of 2000-mesh silicon micropowder, and 5 parts of gas-phase hydrophobic silica.

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Abstract

The invention provides a high-elasticity modified epoxy seam sealing adhesive. The high-elasticity modified epoxy seam sealing adhesive comprises a component A and a component B in a volume ratio of (2-4): 1; the component A is prepared from the following components in parts by mass: 80 to 120 parts of bisphenol A epoxy resin, 15 to 20 parts of dodecadecyl to tetradecyl glycidyl ether, 20 to 40 parts of epoxy-terminated polyurethane, 110 to 150 parts of first filler, 800-mesh silica powder, 2000-mesh silica powder and 2 to 5 parts of gas-phase hydrophobic white carbon black; and the component B is prepared from the following components in parts by mass: 30 to 40 parts of polyether polyamine curing agent, 1 to 2 parts of accelerant DMP-30, 20 to 30 parts of nonylphenol modified amine, 1 to 2 parts of coupling agent and 52 to 75 parts of second filler. The bisphenol A epoxy resin, the dodecadecyl to tetradecyl glycidyl ether and the nonylphenol modified amine are added into the component A in the seam sealing adhesive, meanwhile, the polyether polyamine curing agent is added into the component B, the seam sealing adhesive has high elasticity through interaction among functional groups, meanwhile, the enough complexity rate and connection rate can be reserved, and the seam sealing adhesive has a certain mechanical property index.

Description

technical field [0001] The invention is a highly elastic modified epoxy sealant, which belongs to the technical field of epoxy glue. Background technique [0002] With the vigorous development of aerospace, rail transit, construction and other fields, the construction requirements of corresponding roads are also gradually increasing. Among them, asphalt pavement, as the main structural form of dynamic load road pavement, has the advantages of comfortable and safe driving, low noise, and no dust. , but similarly, asphalt pavement has disadvantages such as high-temperature rutting, low-temperature cracking, and poor resistance to natural factors. For example, the maximum temperature of asphalt pavement in summer will be as high as 65°C and above, and severe high temperature will reduce the tolerance of asphalt pavement and even cause cracks. When there are cracks in the asphalt road, it needs to be filled with colloid. [0003] Most of the existing sealing adhesives are fast-...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J175/04C09J11/04C09J11/06C08G59/50
CPCC09J163/00C09J11/04C09J11/06C08G59/504C08L75/04C08K3/36C08K7/26C08K5/5435
Inventor 赖永安赖克爱
Owner 杭州固安科技有限公司
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