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Intermittent plasma oxidation method and device and preparation method of solar cell

A plasma and oxidation device technology, applied in circuits, discharge tubes, photovoltaic power generation, etc., can solve the problems of increasing the production cost of TOPCon solar cells, the uniformity of mass production, high efficiency, and low uniformity of silicon oxide layers. Achieve the effects of shortening process time, high passivation quality and increasing production capacity

Pending Publication Date: 2021-11-09
苏州拓升智能装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thermal oxidation method usually adopts a temperature of 600-650°C. At this temperature, a graphite boat cannot be used but a quartz boat is required. In this way, the preparation of the silicon oxide layer and the polysilicon layer needs to be completed in two separate reaction chambers during the production process. After the thermal oxidation is completed, the substrate needs to be taken out of the quartz boat and put into the graphite boat for the preparation of the polysilicon layer, which not only adds additional production steps, but also introduces uncertain factors that affect the yield, such as substrate pick-and-place Damage to the silicon oxide layer during the process
For the PECVD method, the inventors of the present invention have found that the silicon oxide layer prepared by the existing PECVD method has the problem of low uniformity, and its uniformity has not yet reached the requirements for mass production of high-efficiency TOPCon solar cells.
Due to the characteristics of atomic layer deposition, the PEALD method can obtain a relatively uniform silicon oxide layer with a large area, but the PEALD method needs to utilize gases such as organosilanes as precursors, which significantly increases the production cost of TOPCon solar cells. In addition, the invention of the present invention People also found that in the oxidation process of the PEALD method, the oxygen-containing plasma not only oxidizes the organic silane adsorbed on the surface, but also oxidizes the substrate under the adsorption layer, thereby affecting the quality of passivation.

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  • Intermittent plasma oxidation method and device and preparation method of solar cell

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Embodiment 1

[0038] Example 1 : the n-type silicon wafer of 166mm is also adopted, through the intermittent plasma oxidation method of the embodiment of the present invention, that is, the excitation signal of the alternately on state and the off state is used to make the plasma ionization of the processing gas to oxidize the surface of the n-type silicon wafer, The PL diagrams of the obtained samples were significantly more Figure 5A The sample in is homogeneous, such as Figure 5B shown.

[0039] The inventors of the present invention have found after research that the electric field distribution is relatively uniform in the initial stage of the plasma, and as time goes by, the distribution of charges in the plasma changes and affects the distribution of the electric field, especially the electric field confined in the plasma. The aggregation of negatively charged ions forms large particles, resulting in non-uniform silicon oxide films produced. The excitation signal used in the int...

Embodiment 2

[0042] Example 2 : In TOPCon solar cells, the main factors affecting cell efficiency are passivation quality and contact resistance (ρ c ), while the passivation quality is usually measured by the effective minority carrier lifetime (τ eff ), implied open circuit voltage (iV oc ) and saturation recombination current (J 0,s ) to represent. Table 1 lists when the processing gas is oxygen (O 2 ) and argon (Ar) mixed gas, adopt the intermittent plasma oxidation method of the embodiment of the present invention to oxidize both sides of the n-type silicon substrate to form an oxide layer, and then form a polysilicon layer and an electrode layer on the oxide layer , to test the passivation quality characteristic parameters of the oxide layer. The difference of embodiment 2A, embodiment 2B and embodiment 2C process conditions in table 1 is the oxygen (O 2 ) / Argon (Ar) flow rates are 3000sccm / 1000sccm, 2000sccm / 2000sccm and 1000sccm / 3000sccm respectively, and other process condi...

Embodiment 3

[0046] Example 3 : Table 2 lists when the processing gas is laughing gas (N 2 O) and nitrogen (N 2) mixed gas, adopt the intermittent plasma oxidation method of the embodiment of the present invention to oxidize the passivation quality characteristic parameters of the n-type silicon substrate, the sample structure is the same as that in Example 2, and also oxidize on both sides of the n-type silicon substrate An oxide layer is formed, and then a polysilicon layer and an electrode layer are formed on the oxide layer to test the passivation quality characteristic parameters of the oxide layer. Laughing gas (N 2 O) and nitrogen (N 2 ) flow rate is 2000sccm / 2000sccm, the difference in process conditions is that the plasma start-up time corresponding to embodiment 3A, embodiment 3B and embodiment 3C is respectively 5 seconds, 10 seconds and 20 seconds, and other process conditions are all the same . Comparative Example 3 in Table 2 also shows the characteristic parameters of ...

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Abstract

The embodiment of the invention provides an intermittent plasma oxidation method, a preparation method of a TOPCon solar cell, an intermittent plasma oxidation device and a computer readable storage medium. The intermittent plasma oxidation method comprises the steps: enabling processing gas plasma in a plasma processing chamber to be ionized through an excitation signal, so that to-be-processed gas in the processing chamber is oxidized to form an oxide layer, wherein the excitation signal comprises an on state and an off state which are alternately carried out, a pulse or sinusoidal signal is output during the on state, and no power is output during the off state; and the duration of the on state and the off state is longer than a pulse or sinusoidal signal period.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to an intermittent plasma oxidation method, a TOPCon solar cell preparation method, a plasma oxidation device and a computer-readable storage medium. Background technique [0002] TOPCon (Tunnel Oxide Passivated Contact) solar cells have attracted widespread attention in the photovoltaic industry in recent years. A typical TOPCon solar cell such as figure 1 As shown, it includes a substrate 11, an emitter 12 formed on the front surface of the substrate 11, a passivation anti-reflection layer 13 and a first electrode 14 formed on the emitter 12, and a An ultrathin oxide layer 15 , a heavily doped polysilicon layer 16 formed on the ultrathin oxide layer 15 , and a second electrode 17 formed on the heavily doped polysilicon layer 16 . Wherein, the substrate 11 may be, for example, a silicon substrate, and the ultra-thin oxide layer 15 may be, for example, a silico...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/06H01L31/18H01J37/32
CPCH01L31/06H01L31/186H01J37/32192H01J2237/3321Y02E10/50Y02P70/50
Inventor 刘景博孙烨叶继春周玉龙曾俞衡张文博闫宝杰王玉明张青山
Owner 苏州拓升智能装备有限公司
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