Semitransparent closed solvent-free epoxy prime coat compound

A closed, solvent-free technology, used in epoxy resin coatings, coatings, etc., can solve the problems of poor sealing due to poor wetting, sudden increase in cost, construction difficulties, etc., and achieve good film-forming performance, good sealing performance, The effect of high cost advantage

Active Publication Date: 2021-10-01
MIANYANG HUILI EPOXY ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the water-based epoxy primer is not easy to penetrate, and there will be defects of poor wetting and sealing on some relatively poor base surfaces, and it cannot repair the potholes on the cement floor very well, thus limiting its use.
The solvent-free epoxy primer is usually a filler-free compound. Contrary to the water-based primer, it will have serious penetration on the concrete base surface, resulting in the inability to effectively form a film on the concrete surface and achieve a sealing effect.
Due to the high viscosity of the solvent-free primer, the construction is difficult, and solid epoxy resin and polyamide are rarely used, so the penetration phenomenon of the solvent-free primer on the market is very serious, and it is difficult to achieve a good sealing effect in one-time construction. It needs to be coated twice, resulting in an increase in dosage and a sharp increase in cost

Method used

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  • Semitransparent closed solvent-free epoxy prime coat compound
  • Semitransparent closed solvent-free epoxy prime coat compound
  • Semitransparent closed solvent-free epoxy prime coat compound

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Preparation of intermediate [a]: Heat 1,4-butanediol diglycidyl ether to 100°C in a reaction kettle, and then put in the same amount of 1,4-butanediol diglycidyl ether under constant stirring Parts by mass of flake, powder or granular E20 bisphenol A epoxy resin is dissolved in 1,4-butanediol diglycidyl ether to form a colorless and transparent homogeneous phase.

[0036] Preparation of component A: Add 26 parts of E51 bisphenol A epoxy resin, 11 parts of 1,4-butanediol diglycidyl ether, and 10 parts of 1 μm (D50) crystalline silica powder to 10 parts of intermediate [a] , 42 parts of 10μm (D50) crystalline silicon powder, 0.3 part of defoamer (BYK-A530); 0.2 part of dispersant (BYK-9011); coupling agent (γ-glycidyl etheroxypropyl trimethoxysilane, KH560 ) 0.5 part, and mix uniformly by high-speed dispersion;

[0037]Preparation of cardanol-modified phenalkamine curing agent: add cardanol in the reaction kettle, add hexamethylenediamine and Aradur 5200 dropwise after h...

Embodiment 2

[0040] Preparation of intermediate [b]: heat neopentyl glycol diglycidyl ether to 100°C in a reaction kettle, and then put in flake, Powdered or granular E20 bisphenol A epoxy resin can be dissolved in neopentyl glycol diglycidyl ether to become a colorless and transparent homogeneous phase.

[0041] Preparation of component A: Add 21 parts of E51 bisphenol F epoxy resin, 11 parts of neopentyl glycol diglycidyl ether, 10 parts of 1.5 μm (D50) crystalline silica powder to 15 parts of intermediate [b], 15 μm (D50) 42 parts of crystalline silicon powder, 0.3 part of defoamer (BYK-A530); 0.2 part of dispersant (BYK-9011); 0.5 part of coupling agent (γ-glycidyl etheroxypropyl trimethoxysilane, KH560) parts, and mix evenly through high-speed dispersion;

[0042] Preparation of cardanol-modified phenalkamine curing agent: add cardanol in the reaction kettle, add ethylenediamine and Aradur 5200 dropwise after the temperature rises to 80-100°C, add paraformaldehyde in batches after th...

Embodiment 3

[0045] Preparation of intermediate [c]: Heat 1,6-hexanediol diglycidyl ether to 100°C in a reaction kettle, and then put in the same amount of 1,6-hexanediol diglycidyl ether under constant stirring The E20 bisphenol A epoxy resin in the form of flakes, powders or granules is dissolved in 1,6-hexanediol diglycidyl ether to form a colorless and transparent homogeneous phase.

[0046] Preparation of component A: Add 24 parts of E54 bisphenol A epoxy resin, 11 parts of 1,6-hexanediol diglycidyl ether, and 10 parts of 1.3 μm (D50) crystalline silicon powder to 12 parts of intermediate [c]. Parts, 13μm (D50) crystalline silicon powder 42 parts, defoamer (BYK-A530) 0.3 part; dispersant (BYK-9011) 0.2 part; coupling agent (γ-glycidyl etheroxypropyltrimethoxysilane, KH560) 0.5 parts, and mix uniformly through high-speed dispersion;

[0047] Preparation of cardanol-modified phenalkamine curing agent: add cardanol in the reaction kettle, add hexamethylenediamine and Aradur 5200 dropwis...

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Abstract

The invention discloses a semitransparent closed type solvent-free epoxy prime coat compound. The component A of the compound is composed of epoxy resin, a bifunctional reactive diluent, crystalline silicon micro-powder and an auxiliary agent, and the component B is composed of a cardanol modified phenolic aldehyde amine curing agent, a coupling agent and a waterproof agent. The closed solvent-free epoxy prime coat is solvent-free, has the characteristics of strong bonding force with a base material, excellent sealing performance on a calcium silicate board and a concrete base surface, high transparency and low total heat value, and has a stronger cost advantage and a better application prospect.

Description

technical field [0001] The invention relates to the technical field of epoxy-containing primers, in particular to a translucent closed solvent-free epoxy primer compound. Background technique [0002] For a long time, epoxy resin has been often used as a primer material for its excellent adhesive properties, and it can achieve a good bonding effect with many substrates. In the epoxy floor coating industry, the epoxy primer is excellently combined with the ground layer and the mortar layer. In addition, it can also play a very important role in sealing the ground. [0003] However, in order to improve the bonding ability of epoxy floor primer, some solid epoxy resins are usually selected for use with high-viscosity polyamide curing agents. In this case, if no solvent is used, the viscosity will be very high. A / B components are difficult to mix evenly and construction is difficult; if these high-viscosity materials are not selected, the bonding strength will be affected. [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/02C09D7/61C08G59/62
CPCC09D163/00C09D7/61C09D7/68C09D7/69C08G59/62C08G59/621C08K2201/014C08L2205/025C08L63/00C08K3/36
Inventor 周鸿飞刘健陆南平
Owner MIANYANG HUILI EPOXY ENG
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