Wafer test data analysis method and platform, electronic equipment and storage medium

Abstract

The invention provides a wafer test data analysis method and platform, electronic equipment and a storage medium. The analysis method comprises the steps of obtaining wafer test data of multiple batches; distinguishing the wafer test data according to the catalogue classification information, recording a storage path of the distinguished wafer test data, and performing catalogue classification and archiving; according to the target directory classification information, indexing a data path of corresponding wafer test data from a directory, extracting the wafer test data, and merging the wafer test data into a target data set according to the target parameter; performing view construction and view analysis on the target data set, and / or performing data statistical analysis; rapid extraction, classification, integration and analysis of wafer test data are realized, effective information can be provided for failure analysis, and the design and manufacturing yield is improved; the mode that a directory index wafer test data file path serves as the basis of data integration, the data integration and analysis efficiency can be effectively improved, and calculation and operation loads are reduced.

Description

technical field [0001] The present application relates to the technical field of chip testing, in particular, to an analysis method, platform, electronic equipment and storage medium of wafer testing data. Background technique [0002] The testing of integrated circuits includes wafer testing (Circuit Probing) before packaging and final testing (Final Test) after packaging. [0003] At present, the wafer test is to test each die on the wafer (Wafer) with a probe (Probe) contact point (Pad), send a start signal to start the test through the interface, and send back a classification signal after the test is completed For the detector, the failed products outside the qualified line range of each parameter preset in the test program are screened out and eliminated. The test system can output the wafer test data of each LOT, including the yield rate of each piece of a single LOT and its BIN information. [0004] However, the existing wafer test system only records the wafer tes...

AI Technical Summary

Problems solved by technology

[0004] However, the existing wafer test system only records the wafer test data, and cannot effectively integrate and analyze the data after recording. It is difficult for engineers to analyze based on the measured wafer test data to improve the design and manufacturing end. If the data is directly exported and sorted through personal experience, it will seriously restrict the efficiency of analysis

[0005] For the above problems, there is no effective technical solution

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