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Composition for forming release layer for slit die coating, and release layer

A technology of peeling layer and composition, which is applied to the device, coating, lamination and other directions of coating liquid on the surface, can solve the problem of uneven coating, and achieve the effect of improving the yield and speeding up the manufacturing process

Active Publication Date: 2021-09-07
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, uneven coating occurs due to the influence of residual solvent due to reduced pressure, so it is necessary to improve the uneven coating

Method used

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  • Composition for forming release layer for slit die coating, and release layer
  • Composition for forming release layer for slit die coating, and release layer
  • Composition for forming release layer for slit die coating, and release layer

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0169] In preparation of the composition for peeling layer formation of this invention, the solution of the specific copolymer (polymer) obtained by the polymerization reaction in a solvent can be used as it is. In this case, for example, in the solution of (A) component, put (B) component, further (C) component, (D) component, (E) component, etc. in the same manner as above, to make a uniform solution . At this time, for the purpose of adjusting the concentration, a solvent may be further added. In this case, the solvent used for the production|generation process of (A) component and the solvent used for concentration adjustment of the composition for peeling layer formation may be the same or different.

[0170] In addition, it is preferable to use the solution of the prepared composition for peeling layer formation after filtration using a filter or the like with a pore diameter of about 0.2 μm.

[0171] The viscosity of the composition for forming a peeling layer of the ...

Embodiment

[0188] Synthesis examples, preparation examples, examples and comparative examples are listed below to describe the present invention in more detail, but the present invention is not limited by the following examples.

[0189] The compounds used in the following examples are as follows. Note that the vapor pressure is a value at 20°C.

[0190] PGME: Propylene glycol monomethyl ether (vapor pressure 1200Pa)

[0191] PGMEA: Propylene Glycol Monomethyl Ether Acetate (Vapor Pressure 500Pa)

[0192] EL: ethyl lactate (vapor pressure 279Pa)

[0193] GBL: γ-butyrolactone (vapor pressure 150Pa)

[0194] DEGEEA: diethylene glycol monoethyl ether acetate (vapor pressure 6Pa)

[0195] Triglyme: triethylene glycol dimethyl ether (vapor pressure 120Pa)

[0196] Diglyme: Diethylene glycol dimethyl ether (vapor pressure 330Pa)

[0197] PL-LI: 1,3,4,6-Tetrakis(methoxyethyl)glycoluril (manufactured by Allnex, trade name: POWDERLINK1174)

[0198] PPTS: pyridinium p-toluenesulfonate

[0...

Synthetic example 1

[0206] [Synthesis Example 1] Synthesis of polyurea (L1)

[0207] Dissolve 100 g of monoallyl diglycidyl isocyanurate (manufactured by Shikoku Chemical Industry Co., Ltd.), 66.4 g of 5,5-diethylbarbituric acid, and 4.1 g of benzyltriethylammonium chloride After 682 g of PGME, it was made to react at 130 degreeC for 24 hours, and the solution (20 mass % of solid content concentration) containing polyurea (L1) was obtained. Results of GPC analysis: Mw of the obtained polyurea (L1) was 8,000, and Mw / Mn was 1.5.

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Abstract

The present invention provides a composition for forming a release layer for slit die coating, which contains (A) a polyurea that contains a repeating unit represented by formula (1), (B) an acid compound or a salt thereof, (C) a crosslinking agent that is selected from among compounds having nitrogen atoms which are substituted by a hydroxyalkyl group and / or an alkoxymethyl group, (D) a polymer additive which contains a repeating unit represented by formula (a1), a repeating unit represented by formula (b) and a repeating unit represented by formula (c), and (E) a solvent that contains at least one solvent which has a vapor pressure of 800 Pa or less at 20 DEG C; and this composition is configured such that 3-100 parts by mass of the polymer additive (D) is contained per 100 parts by mass of the polyurea (A).

Description

technical field [0001] The present invention relates to a composition for forming a release layer and a release layer used for slot die coating. Background technique [0002] In recent years, in addition to characteristics such as thinning and lightening, electronic devices have been required to be given a function of being able to bend. Therefore, it is required to use a lightweight flexible plastic substrate instead of the existing heavy, fragile and inflexible glass substrate. [0003] In particular, for next-generation displays, the development of an active matrix type full-color TFT display panel using a lightweight flexible plastic substrate (hereinafter also referred to as a resin substrate) is sought. In addition, in the case of touch panel displays, materials suitable for flexibility such as transparent electrodes and resin substrates of touch panels used in combination with display panels have been developed. As transparent electrodes, other transparent electrode...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D1/26B05D5/00B32B27/00C08G73/06C08K5/42C08L33/16C09D179/04C08L79/04B32B37/26
CPCB05D1/26B05D5/00B32B27/00B32B37/26C08G73/06C08K5/42C08L33/16C08L79/04C09D179/04C09D5/008C08K5/0025C08K5/3492C08K5/34922C08K5/3445C08K5/13C08L33/14
Inventor 进藤和也江原和也
Owner NISSAN CHEM IND LTD
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