Processing method of circuit-flush printed board

A processing method and printed board technology, which is applied in the manufacture of printed circuits, the removal of conductive materials by chemical/electrolytic methods, printed circuits, etc., can solve the problems of low grinding efficiency and large differences in grinding coplanarity, and avoid grinding The process and coplanar consistency are high, and the effect of reducing manufacturing difficulty

Pending Publication Date: 2021-09-07
XIAN MICROELECTRONICS TECH INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the disadvantages of low polishing efficiency and large difference in polishing coplanarity in the above-mentioned prior art, the object of the present invention is to provide a method for processing circuit flush printed boards

Method used

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  • Processing method of circuit-flush printed board
  • Processing method of circuit-flush printed board
  • Processing method of circuit-flush printed board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A method for processing circuit flush printed boards, comprising the following steps:

[0036] Step 1) as in figure 2 As shown, prepare two pieces of copper foil 101 with a thickness of 25 μm, and cover the surface of one of the copper foils 101 with acrylic resin 102 with a thickness of 20 μm to obtain a resin copper foil, and quickly press the resin copper foil and the other piece of copper foil 101 together, The rapid pressing conditions are temperature 120° C.; pressure 15 Psi; time 5 min. Then bake and cure, the condition parameters of bake and cure are: temperature 130°C; time 1.5h. get the substrate;

[0037] Step 2) Covering the dry film 103 on one side of the substrate, and pasting the dry film 103 on the other side according to the preset printed pattern, and then etching the substrate covered with the dry film 103 to obtain a sheet with the printed pattern;

[0038] Step 3) as in image 3 As shown, the sheet, the prepreg 104 and the insulating substrate ...

Embodiment 2

[0041] A method for processing circuit flush printed boards, comprising the following steps:

[0042] Step (1) as figure 2 As shown, one side of the copper foil 101 is covered with a layer of acrylic resin 102 with a total thickness of 15 μm by spraying. It is beneficial to subsequent removal. The thickness of copper foil 101 depends on the design requirements of printed graphics. Generally, the thickness of copper foil 101 should be ≥ 18 μm. In this embodiment, the thickness of copper foil 101 is 18 μm to ensure sufficient Rigidity and maneuverability.

[0043] Step (2) Use the copper foil 101 of the same thickness, and carry out fast pressing with the copper foil 101 coated with acrylic resin 102 under vacuum conditions. The fast pressing conditions are temperature 150° C.; pressure 15 Psi; time 4 minutes. After rapid pressing, bake at 120°C for 2 hours to cure the resin layer.

[0044] Step (3) Cover the fast-pressed material with a dry film 103 on one side for protecti...

Embodiment 3

[0050] A method for processing circuit flush printed boards, comprising the following steps:

[0051] Step (1) Coating a layer of acrylic resin 102 with a total thickness of 5 μm on one side of the copper foil 101 by spraying or rolling, and the thickness of the copper foil 101 is 20 μm.

[0052] Step (2) Use the copper foil 101 of the same thickness, and carry out rapid pressing with the copper foil 101 coated with acrylic resin 102 under vacuum conditions, the rapid pressing conditions are temperature 100° C.; pressure 10 Psi; time 1 min. After rapid pressing, bake at 100°C for 1 hour to cure the resin layer. The purpose of selecting copper foils 101 with the same thickness is to maintain overall symmetry and reduce bending caused by different expansions of materials.

[0053] Step (3) Cover the fast-pressed material with a dry film 103 on one side for protection, and cover the other side with a dry film 103 according to the required printed pattern for protection, and then r...

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Abstract

The invention discloses a processing method of a circuit-flush printed board, and belongs to the field of circuit printed boards. According to the method, a copper foil of which the circuit needs to be manufactured is bonded with a process copper-clad layer through the specific resin, a required printed pattern is processed firstly, then glue filling is carried out reversely to embed a printed conductor, then etching to remove the process copper-clad layer, removing the resin through alkali liquor, so that the embedded conductor can be exposed, and the circuit is flush. Compared with the conventional method, according to the method, polishing is not needed, and the problems that the polishing efficiency is low and the polishing coplanarity is different do not exist; no special requirement for the thickness of an outer layer copper exists, more types of products can be adapted, and the coplane consistency of the products is higher; the polishing process in a traditional processing method is avoided, the manufacturing difficulty of the product is reduced, and the application field of the flush printed board is improved.

Description

technical field [0001] The invention belongs to the field of circuit printing plates and relates to a processing method for circuit flush printed boards. Background technique [0002] The line flush printed board is to embed the printed wires in the insulating base material, so that the wires are flush with the surface of the substrate, and realize the functions of integrated switch conversion and control switching. It has the advantages of reliability, durability, miniaturization, and light weight. A type of printed circuit board product with a special structure. The usual flush printed board processing adopts the method of positive addition. First, the printed pattern is made according to the process method of the conventional printed board product, and then the epoxy resin prepreg is pressed to embed the printed pattern, and then removed by grinding. The resin covering the printed graphics exposes the printed graphics to achieve the leveling of the wires and the substrat...

Claims

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Application Information

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IPC IPC(8): H05K3/02H05K3/06H05K3/00
CPCH05K3/02H05K3/06H05K3/0067
Inventor 雷雨辰高静茹
Owner XIAN MICROELECTRONICS TECH INST
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