High-power heat dissipation circuit structure

Abstract

The invention discloses a high-power heat dissipation circuit structure, and belongs to the technical field of design and integration of power amplification circuits. The method comprises the steps: building a high-power operational amplifier circuit through a multi-stage split circuit, wherein the multi-stage split circuit is built in a multi-stage amplification circuit mode, chips for achieving the amplification function in the multi-stage amplification circuit are MMBT5551, 2SC4793, 2SA1837, MMBT5401 and OP2177 chips, and the amplification chips achieve multi-stage amplification in a specific cascade connection mode; therefore, the heat dissipation characteristic of the high-power module circuit is optimized, large-size devices such as a fan or a metal radiator are prevented from being used, and the integration of the circuit is greatly improved.

Description

technical field [0001] The invention relates to a high-power heat dissipation circuit structure, which belongs to the technical field of design and integration of power amplifying circuits. Background technique [0002] With the continuous development of electronic equipment, the requirements for electronic technology are getting higher and higher. No matter in the field of modern communication systems, automation and control, power amplifier circuits are inseparable, so the requirements for the integration of amplifier circuits are getting higher and higher. . [0003] For modern integrated circuits, not only can more cost be saved by increasing the integration level, but more importantly, more functions can be realized and reliability can be improved. Using high-power power amplifier chips and field effect tubes for power amplification can realize chip The volume is smaller, the computing speed is higher, and the power density is higher, but this causes the problem of hea...

AI Technical Summary

Problems solved by technology

[0003] For modern integrated circuits, not only can more cost be saved by increasing the integration level, but more importantly, more functions can be realized and reliability can be improved. Using high-power power amplifier chips and field effect tubes for power amplification can realize chip Smaller size, higher computing speed, and higher power density, but this causes the problem of heat dissipation of high-power chips that cannot be effectively solved

[0004] The traditional heat dissipation method is to dissipate heat from the entire chip, such as adding an exhaust fan or a metal heat sink. Although this can alleviate the heating problem, it will increase the size of the system and reduce reliability. Therefore, the traditional heat dissipation method has certain disadvantages.

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