Glass through hole processing method

Abstract

The invention discloses a glass through hole processing method, which comprises the following steps: placing to-be-processed plate glass in an alkaline solution, carrying out ultrasonic cleaning, washing with deionized water, and drying; irradiating the target area of the plate glass by using laser; etching the plate glass through an etching solution to form a through hole; and performing ultrasonic cleaning on the etched plate glass, wherein the etching solution is prepared from the following components in parts by weight: 10-40 parts of 40 wt.% hydrofluoric acid, 50-200 parts of pure water, 1-40 parts of auxiliary acid, 0.1-10 parts of salt, and 0.05-5 parts of a surface active compounding agent, the surface active compounding agent is formed by compounding a surfactant and acetic acid or alcohol containing 1-3 carbon atoms according to a ratio of 1:(1-10), and the surfactant is one or more of octyl phenyl polyoxyethylene ether, hexadecyl trimethyl ammonium chloride, sodium alpha-olefin sulfonate and polyethylene glycol octyl phenyl ether. The processing method is high in punching yield, and the hole wall is smooth and regular.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging, in particular to a method for processing through-glass holes used as electronic packaging substrates. Background technique [0002] With its excellent chemical, mechanical, electrical and optical properties, glass is used more and more in the electronics industry. In addition to more mature applications in CMOS image sensors (CIS), microfluidics and sensors, glass has broad application prospects in the field of microelectronic packaging technology, and can be used as wafer-level sealing and packaging substrates. [0003] The current micro-processing of glass mainly includes methods such as wet etching, sandblasting, photosensitive glass, plasma etching, focused discharge, and laser ablation. However, due to the fragility and chemical inertness of glass materials, the above methods generally have low efficiency and low yield, making it difficult to achieve mass production. Amon...

AI Technical Summary

Problems solved by technology

However, due to the fragility and chemical inertness of glass materials, the above methods generally have low efficiency and low yield, making it difficult to achieve mass production

Among them, laser ablation and focused discharge can quickly process through-glass vias / blind vias, but microcracks are prone to occur due to thermal stress, and the hole walls are rough

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