Printed circuit board via hole semi-windowing processing device and processing method
A technology for printed circuit boards and processing devices, applied in the directions of printed circuits, manufacturing tools, printed circuit manufacturing, etc., can solve problems such as ink splattering on the pads, affecting the quality of electronic products, and affecting the reliability of printed circuit boards soldering. , to ensure the quality of solder mask, improve adaptability and flexibility, and improve the effect of adaptability
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[0046] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, but the embodiments described in the present invention are some of the embodiments of the present invention, not all of them .
[0047] It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.
[0048] In describing the present invention, it should be noted that the terms "centre", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. indicate The orientation or positional relationship of the invention is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is usually p...
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