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Heat dissipation device and electronic device

A technology of heat dissipation device and heat dissipation fins, which is applied to circuits, electrical components, electric solid devices, etc., can solve the problems of high heat dissipation, low heat dissipation efficiency, and large heat dissipation volume that are not suitable for mobile devices, and achieve strong resistance to external disturbances. , Large heat dissipation benefits, the effect of strengthening the heat exchange effect

Pending Publication Date: 2021-06-22
SHANGHAI WINGTECH ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, for the split-type water-cooled heat dissipation solution, the large heat dissipation volume is difficult to carry, and it is not suitable for efficient heat dissipation of mobile devices, and most of them use single-phase liquid cooling heat dissipation, and the heat dissipation efficiency is not high

Method used

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  • Heat dissipation device and electronic device
  • Heat dissipation device and electronic device
  • Heat dissipation device and electronic device

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0027] see figure 1 , the present invention provide...

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Abstract

The invention provides a heat dissipation device. The heat dissipation device comprises a micro-channel evaporator, a condenser, a micro pump, a heat regenerator and a pipeline. An outgoing pipe of the micro-channel evaporator is connected with the condenser through the pipeline, the condenser is connected with the micro pump through the pipeline, the micro pump is connected with the first end of the heat regenerator through the pipeline, and the second end of the heat regenerator is connected with the outgoing pipe of the micro-channel evaporator through the pipeline. The first end of the heat regenerator is further connected with an incoming pipe of the micro-channel evaporator through the pipeline. The invention further provides an electronic device. According to the heat dissipation device and the electronic device, the heat dissipation requirement of a high-heat-flux heat source in a narrow space can be met, and the heat dissipation efficiency is high.

Description

【Technical field】 [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation device and electronic equipment. 【Background technique】 [0002] The rapid development of the integrated circuit and semiconductor industry has prompted the processing chips to move towards high performance and high integration, which has brought about the continuous increase of power density and the increasingly prominent problems of power consumption wall. Taking common high-performance notebooks as an example, CPU (Central Processing Unit, central processing unit) and GPU (Graphics Processing Unit, graphics processing unit) and other high-power heat source chips all generate heat above 100W. If the heat generated is not timely Exhaust, the chip will automatically limit the performance due to the limitation of the power consumption wall to reduce the heat generation and avoid affecting the user experience, and the long-term high-temperature operati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427
CPCH01L23/427
Inventor 陶建云
Owner SHANGHAI WINGTECH ELECTRONICS TECH
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