Liquid-metal thermal interface material with self-packaging function and preparation method thereof

Abstract

The invention relates to a liquid-metal thermal interface material with a self-packaging function and a preparation method thereof, and belongs to the technical field of thermal interface materials. In the thermal interface material, liquid metal accounts for 70 vol%-99 vol%; and high thermal conductivity filler accounts for 1 vol%-30 vol%. The liquid metal is formed by mixing two or more kinds of liquid metal with different melting points. The preparation method comprises the following steps that raw materials are cleaned, mixed, and then put into an ultrasonic processor, deionized water is added, ultrasonic treatment is carried out, and then filtering and drying are carried out; and then, the mixture is subjected to hot-pressing into a sheet shape, and finish rolling is carried out to obtain the sheet-shaped thermal interface material. According to the liquid-metal thermal interface material, at a use temperature, the high-melting-point part is in a solid state, the low-melting-point part is in a liquid state, the solid-phase part limits flowing of the liquid phase, the self-packaging effect is achieved, and the liquid-metal thermal interface material has a state of softening paraffin and has high flexibility and no fluidity. In addition, the liquid-metal thermal interface material has a high thermal conductivity (greater than 60 W / mK) and good processability. 60 W / mK) and good processability.

Description

technical field [0001] The invention belongs to the technical field of thermal interface materials, and in particular relates to a liquid metal thermal interface material with self-encapsulation function and a preparation method thereof. Background technique [0002] With the development of information electronics technology, electronic devices are showing a trend of miniaturization, thinning, and high integration, and their power density and calorific value are also continuously increasing, which puts forward higher requirements for thermal management materials and technologies. The problem of heat dissipation has become a bottleneck problem in the development of microelectronics technology, and the contact thermal resistance between components in electronic devices is an obstacle that restricts the rapid transfer of heat outward. An effective way of interfacial contact thermal resistance. [0003] At present, the common thermal interface material in the market is thermal ...

AI Technical Summary

Problems solved by technology

Patent CN103722804A proposes a multi-layer structure double-melting point liquid metal thermal interface material, and patent CN108329830A proposes a thermal interface material that combines liquid metal and silicone grease, both to solve the problem of high fluidity of liquid metal after melting, which is easy to cause circuit short circuit And other issues