Printed circuit board copper-containing wastewater treatment process
A technology for wastewater treatment and printed circuit boards, which is used in water/sewage treatment, multi-stage water/sewage treatment, oxidized water/sewage treatment, etc. It can solve the problems of poor purification effect, high production cost, and complicated operation by staff. , to reduce the consumption of raw materials, reduce production costs, and improve the effect of breaking the network
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Embodiment 1
[0045] S1: Collect printed circuit board copper-containing wastewater in the waste liquid pool, add NaClO solution to the waste water, adjust the pH value of the waste liquid to 5.0, and the molar ratio of NaClO to Cu is 150:1;
[0046] S2: Lead the wastewater treated in S1 to the irradiation pool, and irradiate the wastewater with ultraviolet light for 3 hours;
[0047] S3: Lead the wastewater treated by S2 to the network-breaking pool, and add Fe to the network-breaking pool 2+ and H 2 o 2 The mol ratio is the Fenton's reagent of 1:10, and stirs;
[0048] S4: Lead the wastewater treated in S3 to the sedimentation tank, and add NaOH and NaOH with a weight ratio of 5:4 to the sedimentation tank at the same time 2 S, adjust the pH to 8.5;
[0049] S5: Lead the wastewater treated in S4 to the coagulation tank, and add PAC to the coagulation tank;
[0050] S6: Lead the wastewater treated in S5 to the flocculation tank, and add PAM to the flocculation tank;
[0051] S7: Adve...
Embodiment 2
[0053] S1: Collect printed circuit board copper-containing wastewater in the waste liquid pool, add NaClO solution to the waste water, adjust the pH value of the waste liquid to 5.0, and the molar ratio of NaClO to Cu is 150:1;
[0054] S2: Lead the wastewater treated in S1 to the irradiation pool, and irradiate the wastewater with ultraviolet light for 3 hours;
[0055] S3: Lead the wastewater treated by S2 to the network-breaking pool, and add Fe to the network-breaking pool 2+ and H 2 o 2 The mol ratio is the Fenton's reagent of 1:10, and stirs;
[0056] S4: Lead the wastewater treated in S3 to the sedimentation tank, and add NaOH and NaOH with a weight ratio of 5:4 to the sedimentation tank at the same time 2 S, adjust the pH to 8.0;
[0057] S5: Lead the wastewater treated in S4 to the coagulation tank, and add PAC to the coagulation tank;
[0058] S6: Lead the wastewater treated in S5 to the flocculation tank, and add PAM to the flocculation tank;
[0059] S7: Adve...
Embodiment 3
[0061] S1: Collect printed circuit board copper-containing wastewater in the waste liquid pool, add NaClO solution to the waste water, adjust the pH value of the waste liquid to 5.0, and the molar ratio of NaClO to Cu is 150:1;
[0062] S2: Lead the wastewater treated in S1 to the irradiation pool, and irradiate the wastewater with ultraviolet light for 3 hours;
[0063] S3: Lead the wastewater treated by S2 to the network-breaking pool, and add Fe to the network-breaking pool 2+ and H 2 o 2 The mol ratio is the Fenton's reagent of 1:10, and stirs;
[0064] S4: Lead the wastewater treated in S3 to the sedimentation tank, and add NaOH and NaOH with a weight ratio of 5:4 to the sedimentation tank at the same time 2 S, adjust the pH to 9.0;
[0065] S5: Lead the wastewater treated in S4 to the coagulation tank, and add PAC to the coagulation tank;
[0066] S6: Lead the wastewater treated in S5 to the flocculation tank, and add PAM to the flocculation tank;
[0067] S7: Adve...
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