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Method for plating gold on surface of circuit board

A surface gold-plated, circuit board technology, applied in printed circuits, removal of conductive materials by chemical/electrolytic methods, printed circuit manufacturing, etc. and other problems, to achieve the effect of less gold-plated wire residue, uniform gold-plated wire residue, and good bonding and welding.

Pending Publication Date: 2021-06-11
珠海杰赛科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the gold-plated wire pulling process is adopted, the traditional method of manually picking out the gold-plated wire will make the gold-plated wire residue uneven, which is difficult to meet the requirement that the gold-plated wire residue ≤ 4mil, which will affect the binding welding; Scratches the gold-plated part; and if there are more than 400 gold-plated wires after imposition, it is difficult to pick out the gold-plated wires

Method used

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  • Method for plating gold on surface of circuit board

Examples

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Effect test

Embodiment 1

[0036] A method of gold plating on the surface of a circuit board, the schematic diagram of the process is shown in figure 1 , including the following steps:

[0037] (1) Select the circuit board that has been covered with solder resist, cover the circuit board with a blocking point net, and leak the position where gold-plated and gold-plated wires are needed; use a photosensitive wet film (Taiyang PPR-50EB01) to cover the gold-plated pads and gold-plated wire parts, The position of the solder resist is not covered with the photosensitive wet film; then it is dried, the drying temperature is 75 ℃, and the drying time is 25 minutes.

[0038] (2) Use an LDI machine to expose (350mj) the gold-plated wire part, develop and remove the unexposed photosensitive wet film, leave the photosensitive wet film of the gold-plated wire part, and remove the photosensitive wet film of the gold-plated part.

[0039] (3) Paste the anti-plating dry film on the circuit board, use the LDI machine ...

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Abstract

The invention belongs to the technical field of circuit board manufacturing, and discloses a method for plating gold on the surface of a circuit board. According to the method, a wet film and a dry film are covered on the prefabricated circuit board covered with a solder resist, and then a method of etching a gold-plated wire is adopted, so that the gold-plated wire residue of the manufactured circuit board is less than 3.8 mil, the gold-plated wire residue is few and uniform, and the gold-plated part is flat and free of scratches. The surface of the solder resist of the circuit board is clean and free of dirt, and the solder resist is not easy to fall off; and the circuit board is good in binding and welding performance and excellent in electrical performance.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a method for plating gold on the surface of a circuit board. Background technique [0002] Circuit board, also known as printed circuit board or printed circuit board. Green oil (also known as liquid photoresist) is a protective layer coated on the circuit board. Green oil is coated on the circuit board and the substrate that do not need to be soldered to achieve the purpose of long-term protection of the circuit pattern. [0003] In the production of the circuit board, generally after the circuit board is finished with the graphics, the green oil is first covered and then the gold plating process is performed to avoid scratching the gold surface during the production process of the green oil, which will affect the binding effect. When using the gold-plated wire drawing process, the traditional method of manually removing the gold-plated wire will ...

Claims

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Application Information

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IPC IPC(8): H05K3/06H05K3/18
CPCH05K3/061H05K3/188H05K2203/0548
Inventor 刘斌斌关志锋唐有军李超谋齐国栋
Owner 珠海杰赛科技有限公司
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