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Efficient preparation method of diamond/metal matrix composite material

A composite material and metal-based technology, applied in the field of diamond/metal-based composite material preparation, can solve the problems of complexity, diamond graphitization process, large energy loss, etc., to reduce energy loss, control product quality and stability, low cost effect

Active Publication Date: 2021-06-11
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of large energy loss, easy graphitization of diamond and complicated process in the existing method for preparing carbide coating on the surface of diamond, the present invention proposes a high-efficiency preparation method of diamond / metal matrix composite material

Method used

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  • Efficient preparation method of diamond/metal matrix composite material
  • Efficient preparation method of diamond/metal matrix composite material
  • Efficient preparation method of diamond/metal matrix composite material

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Experimental program
Comparison scheme
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specific Embodiment approach 1

[0034] Specific implementation mode 1: The efficient preparation method of diamond / metal matrix composite material in this implementation mode is carried out according to the following steps:

[0035] 1. Weighing and filling:

[0036] Weigh the diamond powder with metal coating, fill the diamond powder in the cavity of the graphite mold, and vibrate the diamond powder with an ultrasonic vibrating table;

[0037] The metal coating is one of W, Ti, Cr, Mo;

[0038] 2. Low temperature diffusion treatment:

[0039] Put the forming mold with diamond powder into the vacuum pressure impregnation furnace and heat it to the low-temperature diffusion temperature for low-temperature diffusion treatment;

[0040] When the coating metal is W, the low-temperature diffusion temperature is 700-750°C, and the holding time is 6-12h;

[0041] When the coating metal is Ti, the low-temperature diffusion temperature is 650-700°C, and the holding time is 5-10h;

[0042] When the coating metal is...

specific Embodiment approach 2

[0056] Embodiment 2: This embodiment differs from Embodiment 1 in that: the thickness of the metal coating in step 1 is 20-500 nm.

specific Embodiment approach 3

[0057] Embodiment 3: This embodiment is different from Embodiment 1 or Embodiment 2 in that: the particle size of the diamond powder in step 1 is 30-120 μm.

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Abstract

The invention discloses an efficient preparation method of a diamond / metal matrix composite material, and relates to a preparation method of a diamond / metal matrix composite material. The problems that an existing method for preparing a carbide coating on the surface of diamond is large in energy loss, graphitization of the diamond is prone to occurring, and the technology is complex are solved. The method comprises the following steps of weighing diamond powder with a metal coating, filling a graphite mold with the diamond powder, performing compacting, carrying out low-temperature diffusion treatment and high-temperature reaction treatment, and carrying out air pressure infiltration. According to the preparation method, a preheating temperature curve is changed, the diamond is subjected to low-temperature long-time diffusion and high-temperature short-time reaction, graphitization of the diamond is avoided through the high-temperature short-time reaction, a compact carbide coating is synthesized on the surface of the diamond in situ in the preparation process of the composite material, the energy loss is reduced, the process is simple, the efficiency is high, the product quality and stability are easy to control, the cost is low, and industrial production and application are easy to realize. The method is suitable for preparing the diamond / metal matrix composite material.

Description

technical field [0001] The invention relates to a preparation method of a diamond / metal matrix composite material. Background technique [0002] With the rapid development of semiconductor technology, the integration of electronic components is getting higher and higher, and electronic power devices are gradually developing in the direction of miniaturization, light weight, and high power density. The problem of heat dissipation has become the key to restricting the efficiency and reliability of electronic equipment. . Traditional Invar, Kovar alloys, W-Cu, Mo-Cu and other materials have the disadvantages of low thermal conductivity and high density; SiC p Composite materials such as / Al have the advantages of low density and adjustable thermal expansion coefficient, but the current thermal conductivity (less than 250W / (m·K)) has been difficult to meet the growing demand for heat dissipation. Diamond has the advantages of excellent thermal conductivity, low thermal expansi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/093B22F3/24B22D23/04C22C1/05C22C26/00
CPCB22D23/04B22F3/093B22F3/24B22F2003/248C22C1/05C22C26/00
Inventor 梁雪李会杨文澍修子扬武高辉陈国钦周畅芶华松姜龙涛康鹏超乔菁
Owner HARBIN INST OF TECH
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