Low-damage machining method based on sapphire crystal orientation and machining direction synergistic principle

Abstract

The invention discloses a low-damage machining method based on a sapphire crystal orientation and machining direction synergistic principle. The low-damage machining method comprises the following steps that S1, before sapphire machining, sapphire is oriented by adopting an X-ray crystal orientation device; S2, the sapphire is clamped on a CNC precision grinding machine, and the axial direction of a grinding wheel in the CNC precision grinding machine is arranged to be parallel to the c-axis direction of the sapphire; and S3, machining process parameters are set through programming, the sapphire is machined through the CNC precision grinding machine, for the M-face sapphire, the grinding wheel conducts grinding in the a-axis direction, and for the A-face sapphire, the grinding wheel conducts grinding in the m-axis direction. According to the method, the selected machining direction is beneficial to reducing the grinding force, reducing the possibility of falling of abrasive particles and improving the surface quality of sapphire grinding machining, and particularly, the method is of great significance to the manufacturing technology of large-size sapphires and groove type structures.

Description

technical field [0001] The invention belongs to the technical field of sapphire processing and manufacturing, and mainly relates to a low-damage processing method based on the principle of synergy between sapphire crystal orientation and processing direction. Background technique [0002] Sapphire material has good optical properties, physical properties, and high melting point. Shows good stability under extreme environmental conditions. With the development and maturity of crystal growth technology for sapphire materials, sapphire materials are more and more widely used in semiconductors, optical windows and other fields. Due to the particularity of sapphire application fields, there are high requirements for the surface quality of sapphire parts. At present, high-quality and low-damage processing technology has become a hot spot and difficulty in the manufacture of sapphire parts. The main reason is that the high hardness and high brittleness of sapphire materials make ...

AI Technical Summary

Problems solved by technology

At present, high-quality and low-damage processing technology has become a hot spot and difficulty in the manufacture of sapphire parts. The main reason is that the high hardness and high brittleness of sapphire materials make the processed surface prone to damage.

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