CVD diamond grinding wheel with surface ordered micro structure

Abstract

The invention discloses a CVD diamond grinding wheel with a surface ordered micro structure. The CVD diamond grinding wheel is characterized in that a layer of diamond film is deposited on the outer circumferential surface of a wheel hub of the grinding wheel, a plurality of micro grinding units with the axial width of 0.2-0.5mm, the circumferential length of 0.3-0.6mm, the circumferential distance of 0.6-1.2mm, and the radial height of the micro grinding unit of 0.4-1.0 mm are machined on the whole outer circumferential surface of the diamond film, and a micro-groove with the size of submillimeter is formed between every two adjacent micro-grinding units; meanwhile, the grinding unit and the micro-grooves are arranged in a staggered and ordered mode; and the top surface of each grinding unit is in a waist shape, and the grinding units and the diamond film are kept in a whole. According to the grinding wheel, the grinding edge number of the grinding wheel in the grinding process can beeffectively improved, the chip formation efficiency and the removal rate of surface materials are improved, the cutting performance is enhanced, and the machining surface quality and the cutting efficiency are improved; and the chip removal capability of the grinding wheel is effectively enhanced, the grinding wheel is not easy to block, the processing surface thermal damage is reduced, and the processing surface quality is further improved.

Description

Technical field [0001] The invention relates to a diamond grinding wheel, in particular to a CVD diamond grinding wheel with an orderly microstructured surface. Background technique [0002] Grinding is an important part of mechanical processing. It has the characteristics of high processing accuracy and good surface quality. As a fixed abrasive tool using diamond as abrasive, diamond grinding wheel is widely used in grinding processing. The traditional diamond grinding wheel is to randomly consolidate the abrasive on the working surface of the grinding wheel through a bonding agent. The abrasive grains are arranged randomly. The geometric shape and size of each diamond abrasive grain are inconsistent, and the contact area between the grinding wheel and the workpiece is large, and the abrasive is out Low height, small chip space, poor chip removal performance, easy blockage of the grinding wheel, aggravated heat generation and accumulation, resulting in local high temperature and...

AI Technical Summary

Problems solved by technology

The grinding wheel prepared by this method can enhance the holding force of the grinding wheel to the abrasive grains, improve the service life and grinding efficiency of the grinding wheel, but since the abrasive grains are randomly pressed into the blind hole, the shape of the top surface of each abrasive grain is random, which affects the precision of the machined surface; at the same time, the depth of the abrasive grains pressed into the blind hole is also inconsistent, so there is a large difference in the edge height of the sharpening edge, which greatly reduces the number of effective sharpening edges of the grinding wheel during grinding. Processing efficiency

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