Manufacturing method of multilayer printed circuit board with embedded magnetic core power supply module
A technology for printed circuit boards and power modules, which is used in multilayer circuit manufacturing, printed circuit manufacturing, printed circuits, etc.
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[0024] A method for manufacturing a multilayer printed circuit board for a power module with embedded magnetic cores, characterized in that it includes the following steps: substrate cutting → drilling and whole hole → CNC milling → inner layer circuit → inner layer etching → core pressing → Etching copper reduction→X-RAY shooting→core drilling→core degumming→drilling through holes→immersion copper plating→outer layer circuit→L2 and L3 layer circuit→inner layer etching→browning→pressing total pressure→outer layer Drilling → Immersion Copper Plating → Outer Circuits → Pattern Plating → Half Hole Milling → Etching T Surface → Etching B Surface → Outer Layer Inspection → Solder Mask Printing.
[0025] It also includes pre-designing the isolation ring at the position of the metallized through hole, that is, the concentric circle. The concentric circle adopts the drilling method. According to the blind hole and the outer layer through hole file, the core hole needs to be pre-larged ...
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