Manufacturing method of multilayer printed circuit board with embedded magnetic core power supply module

A technology for printed circuit boards and power modules, which is used in multilayer circuit manufacturing, printed circuit manufacturing, printed circuits, etc.

Pending Publication Date: 2021-05-11
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, among the surface mount devices of the power module, the area of ​​the inductance element accounts for the largest surface area of ​​the printed board (about 50% of the surface area),...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A method for manufacturing a multilayer printed circuit board for a power module with embedded magnetic cores, characterized in that it includes the following steps: substrate cutting → drilling and whole hole → CNC milling → inner layer circuit → inner layer etching → core pressing → Etching copper reduction→X-RAY shooting→core drilling→core degumming→drilling through holes→immersion copper plating→outer layer circuit→L2 and L3 layer circuit→inner layer etching→browning→pressing total pressure→outer layer Drilling → Immersion Copper Plating → Outer Circuits → Pattern Plating → Half Hole Milling → Etching T Surface → Etching B Surface → Outer Layer Inspection → Solder Mask Printing.

[0025] It also includes pre-designing the isolation ring at the position of the metallized through hole, that is, the concentric circle. The concentric circle adopts the drilling method. According to the blind hole and the outer layer through hole file, the core hole needs to be pre-larged ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Copper thicknessaaaaaaaaaa
Login to view more

Abstract

The invention provides a manufacturing method of a multilayer printed circuit board with a magnetic core-embedded power module. The method includes the following steps: substrate cutting, hole drilling and finishing, CNC groove milling, inner layer circuit, inner layer etching, embedded core pressing, etching copper reduction, X-RAY targeting, embedded core drilling, embedded core degumming, through hole drilling, electroless plating copper electroplating, outer layer circuit, L2 and L3 layer circuit, inner layer etching, browning, total pressing, outer layer drilling, electroless plating copper electroplating, outer layer circuit, pattern electroplating, half-hole milling T surface etching, B surface etching, outer layer detection, and solder resist printing. Research, development and production of the multilayer printed board with the embedded magnetic core are realized, the inductor is embedded in the printed board, the surface area of the printed board is greatly reduced, other components can be arranged more reasonably due to the saved area, and a good solution is provided for high density and miniaturization of a power supply module.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a method for manufacturing a multilayer printed circuit board of a buried magnetic core power supply module. Background technique [0002] Power modules are an important part of power products. With the rapid development of power products, the trend of higher density and miniaturization of power modules is becoming more and more obvious. At present, among the surface mount devices of the power module, the area of ​​the inductance element accounts for the largest surface area of ​​the printed board (about 50% of the surface area), so the inductance element is one of the technical bottlenecks affecting the miniaturization of power supply products. [0003] There is no such special buried core process technology in the industry at present. After process optimization, there is no need to adopt embedded magnetic core lamination positioning technology, magnetic core...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/46H05K3/00
CPCH05K3/0008H05K3/0094H05K3/46H05K3/4644H05K2201/086H05K2203/0221H05K2203/0361H05K2203/06
Inventor 邱成伟王晓槟李小海
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap