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A new type of printed circuit board heat exchanger core with three-dimensional spiral wound flow channel

A printed circuit board, three-dimensional spiral technology, applied in the direction of indirect heat exchangers, heat exchanger types, heat exchange equipment, etc., can solve the problems of increased pumping costs, increased flow resistance, and limited ability to enhance comprehensive performance , to achieve the effects of preventing fouling, enhancing disturbance, and enhancing field synergy

Active Publication Date: 2022-07-12
DALIAN MARITIME UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Different forms of flow channels enhance the heat transfer effect by enhancing the disturbance of the fluid in the heat exchanger. Although the heat transfer effect is enhanced, it also increases the flow resistance and increases the pumping cost.
The traditional runner form can be regarded as a two-dimensional flat flow, and its ability to enhance comprehensive performance is relatively limited.

Method used

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  • A new type of printed circuit board heat exchanger core with three-dimensional spiral wound flow channel
  • A new type of printed circuit board heat exchanger core with three-dimensional spiral wound flow channel
  • A new type of printed circuit board heat exchanger core with three-dimensional spiral wound flow channel

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Embodiment Construction

[0023] In order to make those skilled in the art better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only Embodiments are part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] It should be noted that the terms "first", "second" and the like in the description and claims of the present invention and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It is to be understood that the data so used may be interchanged under appropriate ...

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Abstract

The invention provides a printed circuit board heat exchanger core with a three-dimensional spiral wound flow channel, comprising: a multi-layered metal plate with an etched flow channel on the surface, which is superimposed and welded into one body by vacuum diffusion welding. The heat exchanger core body includes: metal plates with several discontinuous flow channels on both sides, several perforated metal plates, and upper and lower cover plates with several discontinuous flow channels on one side; the heat exchanger core body passes through The upper and lower cover plates are the upper and lower cover plates, the middle is the perforated metal plate, and the metal plates of the discontinuous flow channel are periodically stacked; the upper and lower cover plates are directly connected to the Perforated metal plates are attached. The device of the invention increases the heat exchange area and improves the heat exchange. And effectively enhance the disturbance, eliminating the effect of axial heat conduction.

Description

technical field [0001] The invention relates to the technical field of heat exchange devices, in particular, to a new type of printed circuit board heat exchanger core with a three-dimensional spiral wound flow channel. Background technique [0002] Printed Circuit Heat Exchanger (PCHE) is a compact micro-channel heat exchanger. Compared with traditional plate and shell and tube heat exchangers, it adopts photochemical etching and vacuum diffusion welding technology. It has the advantages of high compactness, high pressure resistance, low temperature and high temperature resistance, high heat exchange efficiency and high reliability. In recent years, it has been widely studied in the fields of nuclear energy, solar energy, and natural gas. [0003] The printed circuit board heat exchanger core is made by welding several plates processed by photochemical etching through vacuum diffusion welding technology. The flow channel forms are mainly linear, Z-shaped, S-shaped and dis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D9/04F28F3/08
CPCF28D9/04F28F3/08
Inventor 纪玉龙邱智灵李延涛
Owner DALIAN MARITIME UNIVERSITY
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