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Ni-based brazing filler metal doped with CeSi2 alloy and brazing diamond thereof

A diamond, ni-cr-b-si technology, applied in the direction of welding/cutting media/materials, welding equipment, welding media, etc., can solve the problem of easy fracture and shedding of diamond abrasive grains, weakening of diamond mechanical strength, diamond holding force, etc. problem, to achieve the effect of promoting the chemical metallurgical reaction at the interface, weakening the catalytic effect, and improving the holding strength

Active Publication Date: 2021-03-30
CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, thermal damage such as diamond graphitization, chemical erosion, and residual stress caused by the catalyst element Ni and brazing high temperature weakens the mechanical strength of the diamond and the holding force of the matrix to the diamond, which leads to the loss of diamond abrasive grains during processing. Prone to breakage and shedding failure

Method used

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  • Ni-based brazing filler metal doped with CeSi2 alloy and brazing diamond thereof
  • Ni-based brazing filler metal doped with CeSi2 alloy and brazing diamond thereof
  • Ni-based brazing filler metal doped with CeSi2 alloy and brazing diamond thereof

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Embodiment Construction

[0018] In order to better understand the technical solutions provided by the present invention, the content of the present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0019] Example of a doped CeSi 2 Alloy Ni-based brazing filler metal, with the following components by mass percentage: Cr accounts for 7%, Si accounts for 4.5%, B accounts for 3%, Fe accounts for 3%, CeSi 2 It accounts for 2%, and the rest is Ni. The specific operation of brazing diamond with it is as follows:

[0020] Weigh 9.8 grams of Ni-Cr-B-Si powder and 0.2 grams of CeSi 2 Alloy, mixed and ball milled in a ball mill for 30 min, the speed of the ball mill was 1000r / min, and the ball-to-material ratio was 10:1; the brazing filler metal and pure Ni-Cr-B-Si brazing filler metal prepared by this method were respectively placed in argon-protected tube In a type furnace, the diamond particles were brazed at 1020 °C for 5 min, and the brazed samples were...

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Abstract

The invention discloses Ni-based brazing filler metal doped with a CeSi2 alloy and brazing diamond thereof. The brazing filler metal is obtained by mechanical ball milling of Ni-Cr-B-Si powder and theCeSi2 alloy for 30-60 min, and the brazing filler metal comprises the following components including, by weight, 6%-8% of Cr, 4%-5% of Si, 2.75%-3.5% of B, 2.5%-3.5% of Fe, 1%-3% of CeSi2 and the balance Ni; and the brazing diamond is obtained by brazing diamond particles with the brazing filler metal in an argon-shielded tubular furnace at the temperature lower than 1100 DEG C, time for keepingthe temperature is less than 30 min, high-strength holding of the diamond by the brazing filler metal can be achieved, and heat damage to the brazing diamond is effectively restrained.

Description

technical field [0001] The invention relates to a doped CeSi 2 Alloyed Ni-based solder and its brazing diamond. Background technique [0002] Diamond is often used to process hard and brittle materials because of its high strength, high hardness, and high wear resistance. The interface between diamond abrasive grains and matrix materials is a key factor determining the service performance of diamond tools. For diamond tools prepared by traditional methods such as mechanical inlaying and electroplating, the diamond can only be mechanically retained in the metal matrix, which limits its ability to obtain sufficient bonding strength, making the diamond easily fall off and fail during the grinding process, thus Affect the processing efficiency and service life of diamond tools. In contrast, brazed diamond tools, due to the strong carbide-forming elements (such as Cr, Ti, V, etc.) in the active solder, will cause a strong chemical bond between the diamond and the solder alloy, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30
CPCB23K35/3033
Inventor 张健李鑫胡永乐张明军毛聪
Owner CHANGSHA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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