Manufacturing method for improving small crimping holes of circuit board

Abstract

The invention discloses a manufacturing method for improving small crimping holes of a circuit board, and the method comprises the following steps: drilling holes in a production board, wherein the drilled holes comprise plugging holes to be filled with resin and crimping holes; metalizing the plugging holes and the crimping holes through copper deposition and full-board electroplating; filling the metalized plugging holes with resin; removing the resin protruding out of the board surface by adopting an abrasive belt grinding plate; manufacturing a mask hole pattern on the production board; thinning the thickness of the copper surface at a non-hole position through etching, and removing a film; adopting an abrasive belt grinding plate for removing a hole ring, protruding out of the board surface, at the thinned hole opening; roughly grinding the board surface of the production board twice, wherein the board grinding directions are opposite during two times of rough grinding; and sequentially manufacturing an outer-layer circuit, a solder mask layer, silk-screen characters, surface treatment and molding on the production board to obtain a circuit board. According to the method, rough grinding treatment is added twice after secondary abrasive belt plate grinding, the directions of the two times of abrasive belt plate grinding are opposite, it can be guaranteed that hole ring burrs at a hole opening are cut off and removed, and the problem that a crimping hole is small due to the hole opening burrs is solved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a production method for improving the small crimping hole of the circuit board. Background technique [0002] When crimping components on some circuit boards at the client side, there is a problem that the crimping holes in the positioning area (generally designed apertures are 0.50mm and 0.36mm) are too small to be crimped, so the minimum aperture of the crimping holes is required during circuit board production They are 0.45mm and 0.31mm respectively, the actual measurement results are 0.42-0.44mm and 0.28mm-0.31mm, and the defective ratio is 100%. [0003] Through section observation and confirmation, it is found that the crimping hole of the problem board has a very obvious rim, which leads to a small hole diameter after electroplating, and the hole diameter in the middle of the hole meets the requirements. Affect the hole diameter; the reason for th...

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the above-mentioned existing technical defects, and provides a method for improving the small crimping hole of the circuit board. By adding rough grinding treatment twice after the second abrasive belt grinding, and the directions of the two grinding plates are opposite, it can Make sure that the ring edge at the orifice is cut and removed, which solves the problem of small crimping holes caused by the orifice edge