Method for designing and manufacturing blue light Mico-LED chip with inverted structure

Abstract

The invention belongs to the field of semiconductor light emitters, and particularly relates to a method for designing and manufacturing a blue light Mico-LED chip with an inverted structure, which adopts a tunneling junction formed by heavily doped p + + GaN and n + + GaN to limit a current path, reduces contact resistance, improves Si donor and Mg acceptor concentrations, improves the radiativerecombination rate of electron holes, and improves the internal quantum efficiency and the light extraction efficiency. According to the invention, the Micro-LED with an inverted structure is adopted,ITO / DBR is respectively used as the transparent conductive layer and the current blocking layer, photons emitted by the active region are reflected by the DBR and then are emitted into the air from the sapphire substrate, and the light extraction efficiency is improved. And meanwhile, the requirements that the Micro-LED display is small in size and easy to miniaturize are met. And the Micro-LED chip is designed into an inverted structure, so that the photoelectric property and the thermal stability of the chip are improved.

Description

technical field [0001] The invention belongs to the field of semiconductor light emitters, in particular to a blue light Mico-LED chip with a flip-chip structure. Background technique [0002] Micrometer-sized Light Emitting Diodes (Micro-LED for short) is a new generation of display technology. When the size of LED chips is reduced to tens of microns or even a few microns, they are called Micro-LED chips. Because each pixel of the Micro-LED display can be addressed and individually driven to light up, the micro-display based on the Micro-LED chips of the three primary colors of red, green and blue can display a pixel pitch of micron level, and the imaging effect is excellent, which can realize high-resolution, High contrast, high color saturation, low power consumption, fast response, strong anti-interference ability, etc., have important application value in high-resolution display, visible light communication and other fields. The continuous development and progress of t...

AI Technical Summary

Problems solved by technology

[0004] At present, Micro-LED has not been popularized, and there are still many technical limitations

Traditional Micro-LED manufacturing uses a deep dry etching process to form electrode through holes to limit the current path, resulting in enhanced non-radiative recombination of electrons and holes on the side walls of the through hole structure, thereby reducing the internal quantum efficiency (IQE), Light extraction efficiency (LEE), at the same time, the Micro-LED chip with a horizontal structure has a larger spacing than the Micro-LED chip with a flip-chip structure, and the display volume is larger, and it is not easy to make miniaturization

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