Surface gradient high-entropy alloy layer and preparation method thereof

Abstract

The invention discloses a surface gradient high-entropy alloy layer and a preparation method thereof. The method comprises the steps that rod-shaped metal source electrode materials such as Cr, Ni, Fe, Cu, Ti, W, Mo and Nb are inserted into small holes of an auxiliary source electrode barrel, and the auxiliary source electrode barrel inserted with the rod-shaped source electrode materials is connected to a working disc of a source electrode pulse power source. The pre-infiltrated base material is suspended in the auxiliary source electrode barrel through a workpiece cathode frame connected into a workpiece pulse power supply and hooks, a double-cathode plasma solid-state metallurgy method is adopted for infiltrating pre-infiltrated elements to the surface of the base material so as to formthe surface gradient high-entropy alloy layer, and the alloy layer comprises a surface deposition layer and a diffusion layer from top to bottom and is metallurgically combined with the base material. The components are in gradient distribution, and the binding force is high. The thickness of the deposition layer can reach up to 60 microns, the thickness of the diffusion layer can reach up to 100microns, and the thicknesses of the deposition layer and the diffusion layer can be adjusted by adjusting process parameters as required. The high-entropy alloy layer can be prepared on the surfacesof workpieces of various complex shapes, the components are controllable, and the organization structure characteristic is good.

Description

technical field [0001] The invention relates to the technical field of surface modification, in particular to a surface gradient high-entropy alloy layer and a preparation method thereof. Background technique [0002] High-entropy alloys are defined as alloys composed of five or more principal elements, and the atomic percentage of each principal element is between 5% and 35%. Although high-entropy alloys have multiple principal elements and tend to form complex phases, the "high-entropy effect" causes the alloy to actually form a solid solution structure with simple fcc or bcc or a combination of the two, rather than forming an intermetallic compound and other complex phases. The excellent performance of high-entropy alloys determines its broad application space. Its potential application areas include: molds and tools, electronic components, engines, wear-resistant coatings, high-frequency AC materials, nuclear structural materials, optical transmission materials, biomed...

AI Technical Summary

Problems solved by technology

However, the above-mentioned preparation methods of high-entropy alloy films (coatings) have certain shortcomings, such as: the high-entropy alloy films (coatings) prepared by physical vapor deposition (PVD) are relatively thin, and have not achieved metallurgical bonding, and the bonding force is poor ; Although the thickness of the high-entropy alloy film (coating) prepared by the cladding method is relatively thick, it is prone to cracks and holes, has many defects, and has component segregation; the preparation process of chemical vapor deposition (CVD) is difficult to control and pollutes the environment, etc.

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