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Refrigeration structure

A refrigeration sheet and cold surface technology, which is applied in refrigerators, refrigeration and liquefaction, radiotherapy, etc., can solve the problems of inconvenient assembly, poor heat dissipation efficiency of refrigeration sheets, complex structure, etc., to reduce assembly costs, solve poor assembly, small size effect

Inactive Publication Date: 2021-03-12
SHENZHEN YUYI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the invention is to provide a refrigeration structure to solve the problems of poor heat dissipation efficiency, complex structure and inconvenient assembly of existing refrigeration fins

Method used

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Embodiment Construction

[0038] It should be noted that, in the case of no conflict, the various embodiments in the invention and the features in the embodiments can be combined with each other. The invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0039] Assembly: Insert a single copper / aluminum tube into the corresponding hole on the hot side cover of the cooling plate, and wait for the next step of processing

[0040] 1(a)-5, the invention relates to a refrigeration structure 100, preferably a semiconductor cooling system, including a semiconductor cooling chip 1, a heat pipe 21 and a radiator 23, and the heat pipe 21 is connected to the semiconductor cooling chip 1 and Radiator 23 forms a kind of integral structure that semiconductor refrigeration sheet carries radiator. In other embodiments, the radiator 23 can also be directly combined with the peltier 1 to form an integral structure.

[0041] The semiconductor cooling chip 1 includ...

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Abstract

The invention relates to a refrigeration structure. The refrigeration structure comprises a semiconductor refrigeration sheet, and the semiconductor refrigeration sheet comprises a PN galvanic coupleparticle layer, a cold surface and a hot surface; the cold surface and the hot surface are correspondingly arranged at the cold end and the hot end of the PN galvanic couple particle layer, and the PNgalvanic couple particle layer is provided with a positive electrode and a negative electrode; the hot end of the PN galvanic couple particle layer uses a heat conducting plate to form the hot surface of the semiconductor refrigeration sheet; and a refrigerant is contained in the heat conducting plate. By adopting the refrigeration structure, a middle ceramic plate and a heat conduction siliconegrease coating are eliminated at the hot end, heat transfer resistance is reduced, and heat conduction / heat dissipation efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation or refrigeration, in particular to a refrigeration structure. Background technique [0002] The process of traditional heat pipe radiator is copper tube + pot copper powder + sintering + tank liquid + vacuum + sintering = complete heat pipe; after the heat pipe is completed, the pipe can be bent, flattened, and finally welded or welded with other heat sinks or heat pipes Riveting etc. The process is complex, and the bending affects the heat dissipation efficiency. [0003] Traditional heat pipe process: the heat pipe is directly welded or riveted to the heat sink. The heat-absorbing end of the heat pipe, that is, the heating area of ​​the evaporating end is affected by the bending process of the copper pipe, and cannot be completely fitted, resulting in a relatively low heat-absorbing and heat-conducting efficiency. [0004] The traditional process of semiconductor refrigeration chips:...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02F28D15/02F28F3/08H01L35/30H10N10/13
CPCF25B21/02F28D15/0275F28F3/08A61N5/0621H10N10/13
Inventor 李兵
Owner SHENZHEN YUYI ELECTRONICS TECH CO LTD
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