Chip packaging structure and vehicle

A chip packaging structure and chip technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of increased dynamic loss, increased parasitic inductance inside the device or module, and large temperature rise, so as to reduce the temperature rise under operating conditions and improve the overall performance, the effect of reducing parasitic inductance

Pending Publication Date: 2021-03-09
BEIJING NEW ENERGY VEHICLE TECH INNOVATION CENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Limited by the packaging form, the power device or power module only dissipates heat on one side, resulting in a relatively large temperature rise of the device or module under working conditions. In addition, the traditional soldering process will perform bonding and wiring on the front of the power chip, which will Increase the parasitic inductance inside the device or module, resulting in increased dynamic losses

Method used

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  • Chip packaging structure and vehicle

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A chip packaging structure, including a first conductive and thermally conductive member 001, a second conductive and thermally conductive member 002, and a first conductive and thermally conductive elastic member 022, the chip is located between the first conductive and thermally conductive member 001 and the second conductive and thermally conductive member 002, the The first thermally conductive elastic member 022 is located between the first thermally conductive member 001 and the chip.

[0031] The chip packaging structure further includes an insulating frame 041, and the insulating frame 041 is arranged on the side of the first conductive and heat-conducting member 001 facing the chip;

[0032] The chips are arranged on the insulating frame 041 .

[0033] The chip package structure further includes a second conductive and thermally conductive elastic member 021 and a third conductive and thermally conductive member 003, the second conductive and thermally conducti...

Embodiment 2

[0056] A chip packaging structure, including a first conductive and thermally conductive member 001, a second conductive and thermally conductive member 002, and a first conductive and thermally conductive elastic member 022, the chip is located between the first conductive and thermally conductive member 001 and the second conductive and thermally conductive member 002, the The first thermally conductive elastic member 022 is located between the first thermally conductive member 001 and the chip.

[0057] The chip packaging structure further includes an insulating frame 041, and the insulating frame 041 is arranged on the side of the first conductive and heat-conducting member 001 facing the chip;

[0058] The chips are arranged on the insulating frame 041 .

[0059] The chip package structure further includes a second conductive and thermally conductive elastic member 021 and a third conductive and thermally conductive member 003, the second conductive and thermally conducti...

Embodiment 3

[0079] A chip packaging structure, the same as the second embodiment will not be repeated, the chip is a diode chip 012;

[0080] in

[0081] The material of the diode chip 012 is but not limited to silicon or silicon carbide, and the diode chip 012 includes a chip front metal system 017 of the diode chip and a chip back metal system 016 of the diode chip.

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PUM

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Abstract

The invention relates to the technical field of chips, and particularly relates to a chip packaging structure and a vehicle. The chip packaging structure comprises a first electric conduction and heatconduction piece, a second electric conduction and heat conduction piece and a first electric conduction and heat conduction elastic piece, wherein the chip is located between the first electric conduction and heat conduction piece and the second electric conduction and heat conduction piece, and the first electric conduction and heat conduction elastic piece is located between the first electricconduction and heat conduction piece and the chip. According to the invention, a power device or module adopts double-sided pressure elastic contact, so that on the one hand, the packaging structurecan form double-sided heat dissipation, and the working condition temperature rise of the power chip and derived devices and modules thereof is further reduced; and on the other hand, a wiring mode ina bonding process is avoided, parasitic inductance in a device or a module is reduced, and the performance of the chip is improved, so that the overall performance is improved.

Description

technical field [0001] The invention relates to the field of chip technology, in particular to a chip packaging structure and a vehicle. Background technique [0002] Power chips and their derived devices and modules are widely used in new energy vehicle parts, mainly to control and process electric energy, and play an important role in motor drive, battery charging, DC control, etc., such as those used in new energy vehicles The power chip requires a higher switching frequency (generally the maximum frequency is above 40Khz), so the power chip is required to have a higher switching frequency and lower switching loss. [0003] At this stage, the power devices or power modules used in new energy vehicles are all welded packages, especially the power modules used in motor drives have relatively high output power under working conditions. [0004] Limited by the packaging form, power devices or power modules only dissipate heat on one side, resulting in a relatively large temp...

Claims

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Application Information

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IPC IPC(8): H01L25/18H01L23/367
CPCH01L23/367H01L25/18
Inventor 黄凯原诚寅
Owner BEIJING NEW ENERGY VEHICLE TECH INNOVATION CENT CO LTD
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