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Oxygen-free copper, preparation method and application

An oxygen-free copper and alloying element technology, applied in the field of preparation and oxygen-free copper, can solve the problems of product macroscopic surface roughness, coarse recrystallized grains, shortened service life, etc., to increase melt fluidity and reduce melt viscosity. , the effect of purifying the melt

Active Publication Date: 2021-02-05
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with ordinary red copper and pure copper, the oxygen-free copper prepared by the above method has significantly improved heat resistance. However, after continuous high-temperature treatment above 500°C, the crystal grains will still increase rapidly, resulting in rough surface of the product ( aka cellulite)
In addition, if the thermal and electrical loads increase rapidly during service, traditional oxygen-free copper is also prone to produce coarse recrystallized grains, resulting in shortened service life and potential safety hazards

Method used

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  • Oxygen-free copper, preparation method and application
  • Oxygen-free copper, preparation method and application
  • Oxygen-free copper, preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0114] This example provides a kind of oxygen-free copper and preparation method thereof, and concrete steps are as follows:

[0115] (1) Weigh Cu-Zr master alloy, Cu-Sr master alloy, Cu-Ce master alloy, Cu-Yb master alloy block and Electrolytic copper plate.

[0116] (2) In the graphite crucible, place a weighed electrolytic copper plate, a uniformly mixed intermediate alloy block, a refining agent accounting for 5% of the sum of electrolytic copper and alloy mass, and a 20cm covering agent (charcoal block and graphite crucible) from bottom to top. pink).

[0117] (3) in N 2 Under +CO gas atmosphere, melt the material in step (2) with an intermediate frequency induction furnace at a melting temperature of 1200°C.

[0118] (4) Under a protective atmosphere, cast the melt with uniform composition in step (3) at 1130°C.

[0119] (5) Under a protective atmosphere, the ingot obtained in step (4) is subjected to a homogenization treatment at a treatment temperature of 600° C. f...

Embodiment 2

[0124] This example provides an oxygen-free copper and its preparation method. The difference between the specific steps and Example 1 is: in step (1), the addition amount of alloying elements is 20ppm Zr, 20ppm Sr, 40ppm Ce, and 80ppm Yb.

[0125] In this example, oxygen-free copper sample 2 was prepared.

[0126] The metallographic structure of oxygen-free copper sample 2 is as follows figure 2 shown.

Embodiment 3

[0128] This example provides an oxygen-free copper and its preparation method. The difference between the specific steps and Example 1 is: in step (1), the addition amount of alloying elements is 15ppm Zr, 15ppm Sr, 15ppm Ce, and 40ppm Yb.

[0129] In this example, an oxygen-free copper sample 3 was prepared.

[0130] The metallographic structure of oxygen-free copper sample 3 is as follows image 3 shown.

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Abstract

The invention provides oxygen-free copper, a preparation method and application. Four alloy elements of Zr, Sr, Ce and Yb are added into the oxygen-free copper. The preparation method comprises the following steps: S1, uniformly mixing electrolytic copper, Zr, Sr, Ce and Yb; adding a covering agent and a refining agent; smelting in a reducing atmosphere; S2, casting a melt with uniform componentsobtained in the step S1 in a protective atmosphere; S3, performing homogenization treatment on a cast ingot obtained in the step S2 under the protective atmosphere; and S4, circularly carrying out a cold deformation recrystallization air cooling process on the homogenized cast ingot in a protective atmosphere. The oxygen-free copper provided by the invention has good heat resistance; and after high-temperature treatment at 900 DEG C, the grain size is not obviously increased.

Description

technical field [0001] The invention relates to the technical field of copper alloys, in particular to an oxygen-free copper, a preparation method and an application. Background technique [0002] Copper has good electrical conductivity, thermal conductivity, weldability, plasticity, ductility and excellent cold workability, and is non-magnetic. Oxygen-free copper refers to pure copper with very low oxygen content and impurity content. Oxygen-free copper partly overcomes the shortcomings of low yield strength and poor creep resistance at high temperature of impurity-containing copper after annealing. It has higher strength and higher thermal conductivity, and has been highly valued by electronic material experts. [0003] Oxygen-free copper is an important material for the preparation of new energy vehicle power module circuit boards and their peripheral components. With the innovation of new energy vehicle technology, the power module circuit board that controls the vehic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/03C22C1/06C22F1/06
CPCC22C9/00C22C1/03C22C1/06C22F1/06Y02P10/20
Inventor 李周马牧之邱文婷肖柱龚深姜雁斌
Owner CENT SOUTH UNIV
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