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Preparation method of aluminum matrix composite material

An aluminum-based composite material and aluminum powder technology, which is applied in the field of electronic packaging materials, can solve the problems that affect the use performance, the strength and expansion coefficient of composite materials are greatly different, and achieve improved heat dissipation, strong material design, and reduced material deformation. Effect

Active Publication Date: 2021-08-03
HUNAN JINTIAN ALUMINUM HI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The existing silicon carbide particle reinforced aluminum matrix composites require a high volume percentage of silicon carbide particles, and the prepared material has a large difference in the strength and expansion coefficient of the composite material due to the interface problem between SiC and aluminum and the dispersion problem of SiC, which affects its Use performance, so it is necessary to develop new processes and methods to solve the above problems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A method for preparing an aluminum-based composite material, comprising the steps of:

[0034] (1) SiO 2 After mixing with carbon fiber at a mass ratio of 3:1, add SiO 2 and expanded graphite powder with 6% of the total mass of carbon fibers, and SiO 2 and 0.8% Al in total carbon fiber mass 2 o 3 , under an argon protective atmosphere, sintered at 1600°C for 20h to obtain a mixture of SiC particles and carbon fibers coated with SiC on the surface, which is designated as mixture 1;

[0035] (2) The mixture 1 in step (1) is sintered in air for 0.5 h, the sintering temperature is 1200° C., and the carbon fibers not covered by SiC in the mixture 1 are removed to obtain the mixture 2. The surface of the mixture 2 forms a plurality of microstructures. hole and silicon oxide layer;

[0036] (3) Mix the mixture 2 of step (2) with Si flakes at a volume ratio of 0.5:1, put them in a drum mill for 10 hours, and then sinter at 1450°C for 12 hours under an argon protective atmo...

Embodiment 2

[0043] A method for preparing an aluminum-based composite material, comprising the steps of:

[0044] (1) SiO 2 After mixing with carbon fiber at a mass ratio of 3.2:1, add SiO 2 and expanded graphite powder with a total mass of carbon fibers of 6.8%, and SiO 2 and 1.5% Al in total carbon fiber mass 2 o 3 , under an argon protective atmosphere, sintered at 1720 ° C for 18 hours to obtain a mixture of SiC particles and carbon fibers coated with SiC on the surface, which is designated as mixture 1;

[0045] (2) The mixture 1 of step (1) is sintered in air for 2 hours, the sintering temperature is 1100°C, and the carbon fibers not covered by SiC in the mixture 1 are removed to obtain the mixture 2, and the surface of the mixture 2 forms a plurality of micropores and silicon oxide layer;

[0046] (3) Mix the mixture 2 of step (2) with the Si sheet at a volume ratio of 1:1, place it in a roller ball mill for 8.5 hours, and then sinter at 1460°C for 10 hours under an argon prot...

Embodiment 3

[0053] A method for preparing an aluminum-based composite material, comprising the steps of:

[0054] (1) SiO 2 After mixing with carbon fiber at a mass ratio of 3.4:1, add SiO 2 and expanded graphite powder with a total mass of carbon fibers of 7.5%, and SiO 2 and 1.4% Al in total carbon fiber mass 2 o 3 , under an argon protective atmosphere, sintered at 1850 ° C for 16 hours to obtain a mixture of SiC particles and carbon fibers coated with SiC on the surface, which is designated as mixture 1;

[0055] (2) The mixture 1 of step (1) is sintered in air for 4 hours, the sintering temperature is 950°C, and the carbon fibers not covered by SiC in the mixture 1 are removed to obtain the mixture 2, and the surface of the mixture 2 forms a plurality of micropores and silicon oxide layer;

[0056] (3) Mix the mixture 2 of step (2) with the Si sheet at a volume ratio of 1.5:1, put it in a roller ball mill for 7 hours, and then sinter at 1470°C for 8 hours under an argon protecti...

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Abstract

The invention discloses a method for preparing an aluminum-based composite material. SiO 2 , carbon fiber, expanded graphite powder and Al 2 O 3 After high-temperature sintering of the mixture, ball milling, adding Si, high-temperature sintering to make Si infiltrate and coat or load on the surface of SiC, then conduct secondary ball milling, add aluminum powder and paraffin to press into sheet, degrease and sinter the sheet, and then carry out multiple Temperature stages, multiple times of densification and pressing, that is. The composite material Si / SiC / Al of the present invention achieves good interfacial bonding among the three, and the physical and chemical properties of atoms and molecules are well matched. At the same time, problems such as material deformation caused by differences in expansion coefficients are reduced, and the coefficient of thermal expansion is low. Light weight, Good mechanical properties, good thermal conductivity, strength, plasticity and heat dissipation, simple operation process, conducive to production control, low cost, easy to weld, easy to industrialized production, can be widely used in the field of electronic packaging, and has a good application prospect.

Description

technical field [0001] The invention relates to the technical field of electronic packaging materials, in particular to a method for preparing an aluminum-based composite material. Background technique [0002] Electronic packaging is the use of film technology and micro-connection technology to arrange, fix and connect semiconductor components and other components on the frame or substrate, lead out the terminals, and seal and fix them through plastic insulating media to form a complete three-dimensional structure. [0003] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, microelectronics puts forward more and more stringent requirements for packaging materials. Electronic device packaging and low expansion coefficient materials in the military industry are rapidly developing towards high density, thinning, miniaturization, and high-demand mechanical properties, resulting in technical bottlenecks such as...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C49/06C22C49/14C22C47/14C22C47/04C22C101/10
CPCC22C47/04C22C47/14C22C49/06C22C49/14
Inventor 刘春轩高平平吴云张扬罗任曹柳絮张杰苏新
Owner HUNAN JINTIAN ALUMINUM HI TECH CO LTD
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