Film with heat dissipation structure and manufacturing method thereof

Abstract

The invention discloses a film with a heat dissipation structure and a manufacturing method of the film. A first inner core is formed by a first low-temperature silver paste layer and a P-type ink layer on the first low-temperature silver paste layer, a second inner core is formed by a second low-temperature silver paste layer and an N-type ink layer on the second low-temperature silver paste layer, and a first heat insulation and insulation ink layer is clamped between the first inner core and the second inner core. The first inner core, the second inner core and the first heat-insulation insulating ink layer are covered by a third low-temperature silver paste layer to form an integral inner core, the upper side and the lower side of the integral inner core are covered by an upper heat-conduction insulating silica gel cloth and a lower heat-conduction insulating silica gel cloth, and the left side and the right side of the integral inner core are covered by a second heat-insulation insulating ink layer and a third heat-insulation insulating ink layer. The manufacturing method comprises the following steps of sequentially forming the first, second and third heat-insulating ink layers, the first and second low-temperature silver paste layers, the P-type ink layer, the N-type ink layer and the third low-temperature silver paste layer on the lower heat-conducting insulating silicagel cloth in a printing, heating and curing manner, and finally adhering the heat-conducting insulating silica gel cloth to the upper surface of the third low-temperature silver paste layer. The heatdissipation temperature of the film prepared by the method can be as low as 0-10 DEG C.

Description

technical field [0001] The invention relates to the technical field of a heat-conducting interface material, in particular to a thin film with a heat dissipation structure and a manufacturing method thereof. Background technique [0002] With the miniaturization, light weight and performance improvement of electronic products, the calorific value of electronic components continues to increase. How to effectively transfer the large amount of heat generated to the outside of the product while reducing weight has become an important issue for electronic products. An important topic of design. [0003] In order to solve the heat dissipation problem of electronic products, heat dissipation materials can be installed to dissipate heat from the heat source. Traditional heat dissipation materials include thermal pads, thermal grease, thermal gel, two-component thermal gap filler, epoxy thermal adhesive, acrylic thermal adhesive and other materials, all of which conduct heat from th...

AI Technical Summary

Problems solved by technology

Traditional heat dissipation materials include thermal pads, thermal grease, thermal gel, two-component thermal gap filler, epoxy thermal adhesive, acrylic thermal adhesive and other materials, all of which conduct heat from the heat source into the environment for heat dissipation, and the heat dissipation temperature is the lowest It is also impossible to be lower than the ambient temperature, so the heat conduction efficiency is not high, and the heat conduction material occupies a large space in consumer electronics, which is inconsistent with the trend of miniaturized consumer electronics products

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