Semiconductor device and manufacturing method thereof

Abstract

The invention provides a semiconductor device and a manufacturing method thereof. The semiconductor device comprises a substrate and a conductive layer covering the surface of the substrate, and the substrate and the conductive layer form a composite substrate. The semiconductor device also includes a dielectric layer covering the conductive layer, wherein the conductive layer is located between the dielectric layer and the substrate. The semiconductor device further includes a gallium nitride-containing composite layer over the composite substrate, a gate electrode disposed on the gallium nitride-containing composite layer, and a source electrode and a drain electrode disposed on the gallium nitride-containing composite layer and on opposite sides of the gate electrode, respectively. Thesemiconductor device comprises the composite substrate with the conductive layer, so that the composite substrate is suitable for a machine table for manufacturing the semiconductor device, and the composite substrate can be attached to the machine table. The stably arranged composite substrate can effectively improve the electrical performance of the electronic component manufactured on the composite substrate. In addition, the conductive layer of the composite substrate comprises a conductive material capable of resisting high temperature, so that the composite substrate can be suitable fora high-temperature thermal process.

Description

technical field [0001] The present invention relates to a semiconductor device and its manufacturing method, and more particularly to a semiconductor device with a composite substrate and its manufacturing method. Background technique [0002] In recent years, semiconductor device structures have developed rapidly in the fields of computers, consumer electronics, and the like. At present, semiconductor device technology has been widely accepted in the product market of metal oxide semiconductor field effect transistors, and has a high market share. Semiconductor devices are used in various electronic applications such as high power devices, personal computers, cell phones, digital cameras, and other electronic devices. These semiconductor devices are generally fabricated by depositing insulating or dielectric layers, conductive layer materials, and semiconductor layer materials on a semiconductor substrate, and then patterning the various material layers by using a photolit...

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Problems solved by technology

Although the existing semiconductor devices and their formation methods can cope with their original intended use, they still have problems to be overcome in various technical aspects of structure and method.

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