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A kind of low thermal expansion cordierite-based glass-ceramic material and preparation method thereof

A low thermal expansion, glass-ceramic technology, used in semiconductor/solid-state device parts, electrical solid-state devices, semiconductor devices, etc. Low electrical constant, improved signal transmission speed, good thermal stability

Active Publication Date: 2022-05-03
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at problems such as poor mechanical properties, mismatched thermal expansion coefficients, and large dielectric loss in the existing ceramic materials in the background technology, which lead to large signal transmission delays and high power consumption, and provides a low thermal expansion cordierite-based microcrystal The glass material and its preparation method can not only achieve good thermal matching with the silicon chip, but also have high bending strength and Young's modulus, and excellent dielectric properties

Method used

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  • A kind of low thermal expansion cordierite-based glass-ceramic material and preparation method thereof
  • A kind of low thermal expansion cordierite-based glass-ceramic material and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] According to the formula: MgO is 15wt%, Al 2 o 3 26wt%, SiO 2 50wt%, ZrO 2 6wt%, B 2 o 3 1wt%, K 2 O is 2wt%. Accurately calculate the weight of the corresponding raw material. After accurate weighing, ball mill for 2 hours to make it evenly mixed; water quenching; then the obtained glass slag is subjected to wet ball milling, dried to obtain glass powder, ball milled with deionized water for 6 hours, and dried to obtain a uniformly dispersed powder; after the powder is granulated and dry pressed, Sintering at 900° C. and holding the temperature for 1 hour to obtain a cordierite-based glass-ceramic material with low thermal expansion.

[0027] The low thermal expansion cordierite-based glass-ceramic material prepared in this embodiment, Mg 2 Al 4 Si 5 o 18 The phase content is 73.4%, (Mg Al 2 Si 3 o 10 ) 0.6 The phase content was 19.1%. The performance indicators are: dielectric constant 5.54 (@1MHz), dielectric loss 0.75×10 -3 (@1MHz), thermal expansion...

Embodiment 2

[0029] According to the formula: MgO is 16wt%, Al 2 o 3 27wt%, SiO 2 49wt%, ZrO 2 5wt%, B 2 o 3 2wt%, K 2O is 1wt%, accurately calculate the weight of the corresponding raw materials, after accurate weighing, ball mill for 2 hours to make it evenly mixed; after drying, put the mixed material in a crucible to melt, heat up to 1400°C for 2 hours, after the melting is complete water quenching; then the obtained glass slag is subjected to wet ball milling, dried to obtain glass powder, ball milled with deionized water for 6 hours, and dried to obtain a uniformly dispersed powder; after the powder is granulated and dry pressed, Sintering at 900° C. and holding the temperature for 1.5 hours to obtain a cordierite-based glass-ceramic material with low thermal expansion.

[0030] The low thermal expansion cordierite-based glass-ceramic material prepared in this embodiment, the XRD pattern is as follows figure 1 , where the main crystal phase is Mg 2 Al 4 Si 5 o 18 , the sub...

Embodiment 3

[0032] According to the formula: MgO is 17wt%, Al 2 o 3 28wt%, SiO 2 47wt%, ZrO 2 4wt%, B 2 o 3 1wt%, K 2 O is 3wt%. Accurately calculate the weight of the corresponding raw material. After accurate weighing, ball mill for 3 hours to make it evenly mixed; water quenching; then the obtained glass slag was subjected to wet ball milling, dried to obtain glass powder, and deionized water was used as a medium for ball milling for 7 hours, and after drying, a uniformly dispersed powder was obtained; after the powder was granulated and dry pressed, Sintering at 925° C. and holding the temperature for 1.5 hours to obtain a cordierite-based glass-ceramic material with low thermal expansion.

[0033] The low thermal expansion cordierite-based glass-ceramic material prepared in this embodiment, Mg 2 Al 4 Si 5 o 18 The phase content is 68.4%, (MgAl 2 Si 3 o 10 ) 0.6 The phase content was 22.6%. The performance indicators are: dielectric constant 5.43 (@1MHz), dielectric los...

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Abstract

The invention belongs to the field of electronic ceramic materials, and provides a low thermal expansion cordierite-based glass-ceramic material and a preparation method thereof, which are used for ultra-large-scale integrated circuit packaging. The glass-ceramic material of the present invention is composed according to the mass percentage: MgO is 15-19wt%, Al 2 o 3 26~30wt%, SiO 2 46~50wt%, ZrO 2 2~6wt%, B 2 o 3 1~5wt%, K 2 O is 1 ~ 3wt%; by introducing K 2 O as modifier, ZrO 2 As a crystal nucleating agent, B 2 o 3 As a fever reducer, it inhibits a part (MgAl 2 Si 3 o 10 ) 0.6 phase inversion to Mg 2 al 4 Si 5 o 18 phase, thereby adjusting the coefficient of thermal expansion towards the Si chip (3.5×10 ‑6 / ℃), and at 2.5~3.5×10 ‑6 / °C adjustable, good thermal stability; at the same time, the bending strength can reach 150-200MPa, the Young's modulus can reach 80-95GPa, the dielectric constant is 5-6 (@1MHz), and the dielectric loss is 0.5-1× 10 ‑3 (@1MHz), which can increase the signal transmission speed and greatly reduce power consumption; in summary, the low thermal expansion cordierite-based glass-ceramic material of the present invention is suitable for VLSI packaging, which can significantly reduce signal transmission delay and power consumption , well matched with silicon chips.

Description

technical field [0001] The invention belongs to the field of electronic ceramic materials, and relates to a cordierite-based glass-ceramic material with low thermal expansion and a preparation method thereof; it is especially suitable for encapsulation of ultra-large-scale integrated circuits. Background technique [0002] In recent years, the rapid development of information technology has promoted the ultra-large-scale and multi-functionalization of integrated circuits, and the search for packaging materials with excellent performance has become the focus of attention; MgO-Al 2 o 3 -SiO 2 It is glass-ceramic, which has the characteristics of low thermal expansion coefficient and excellent dielectric properties, but there are problems such as poor mechanical properties and high sintering temperature. [0003] For example, Journal of Non-Crystalline Solids, 2015, 419: 16-26 reports, K 2 The effect of O on the properties of magnesium-aluminum-silicon glass-ceramics, the gl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C10/08H01L23/15
CPCC03C10/0045H01L23/15
Inventor 李波高陈熊赵翔浔
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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