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A kind of preparation method of uvc-led light-emitting device

A UVC-LED and light-emitting device technology, applied in the direction of semiconductor devices, electrical solid devices, electrical components, etc., can solve the problems of chip and substrate pollution, affect light output and reliability, and affect product air tightness, etc., and achieve a high pass rate , Improve the effect of problems with unqualified products and high yield

Active Publication Date: 2021-08-31
LIANYUNGANG GUANGDING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, external water vapor and impurities can enter the product through air bubbles and air channels, causing pollution to materials such as wafers and substrates, seriously affecting the airtightness of the product, thereby affecting light output and reliability

Method used

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  • A kind of preparation method of uvc-led light-emitting device
  • A kind of preparation method of uvc-led light-emitting device
  • A kind of preparation method of uvc-led light-emitting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A method for preparing a UVC-LED light-emitting device, comprising the following steps:

[0038] S1. Die bonding: fix the chip on the support with flux. The support includes a base and a dam. The bottom of the dam is integrally connected with the base. The support is an aluminum nitride ceramic substrate, and the surface is plated with copper, nickel and gold, and the copper is greater than 65+ / -10u, nickel is greater than 3u, and Au is 0.075u. The bracket is preheated at 130°C for 15 minutes before plasma cleaning, and then cooled at room temperature for 20 minutes. There are Kina diodes, and Kina is a Si substrate;

[0039] The flux is added to the space formed by the dam enclosure, the amount of flux added is 1 / 2 of the chip height, and the flux parameters are required: viscosity = 130KCPS, boiling point at 180°C;

[0040] The parameters of the crystal bonder: the height of the scraper of the glue tray ≤ 1-2mm, the height distance from the origin of the dispensing ...

Embodiment 2

[0057] A method for preparing a UVC-LED light-emitting device, comprising the following steps:

[0058] S1. Die bonding: fix the chip on the support with flux. The support includes a base and a dam. The bottom of the dam is integrally connected with the base. The support is an aluminum nitride ceramic substrate, and the surface is plated with copper, nickel and gold, and the copper is greater than 65+ / -10u, nickel is greater than 3u, and Au is 0.075u. The bracket is preheated at 130°C for 15 minutes before plasma cleaning, and then cooled at room temperature for 20 minutes. There are Kina diodes, and Kina is a Si substrate;

[0059] The flux is added to the space formed by the dam enclosure, the amount of flux added is 1 / 2 of the chip height, and the flux parameters are required: viscosity = 130KCPS, boiling point at 200°C;

[0060] The parameters of the crystal bonding machine: the height of the scraper of the glue tray ≤ 1-2mm, the height distance from the origin of the di...

Embodiment 3

[0077] A method for preparing a UVC-LED light-emitting device, comprising the following steps:

[0078] S1. Die bonding: fix the chip on the support with flux. The support includes a base and a dam. The bottom of the dam is integrally connected with the base. The support is an aluminum nitride ceramic substrate, and the surface is plated with copper, nickel and gold, and the copper is greater than 65+ / -10u, nickel is greater than 3u, and Au is 0.075u. The bracket is preheated at 130°C for 15 minutes before plasma cleaning, and then cooled at room temperature for 20 minutes. There are Kina diodes, and Kina is a Si substrate;

[0079] The flux is added to the space formed by the dam enclosure, the amount of flux added is 1 / 2 of the chip height, and the flux parameters are required: viscosity = 130KCPS, boiling point at 200°C;

[0080] The parameters of the crystal bonding machine: the height of the scraper of the glue tray ≤ 1-2mm, the height distance from the origin of the di...

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Abstract

The invention discloses a method for preparing a UVC-LED light-emitting device, which is characterized in that it comprises the following steps: S1. Solid crystal fixes the wafer on a bracket through flux, and the bracket includes a base and a dam, and the dam The bottom is integrally connected with the base, and the flux is added to the space formed by the surrounding dam; the parameters of the crystal bonder: the height of the scraper of the glue tray ≤ 1-2mm, and the height distance from the origin of the dispensing head to the position of the pulp is between 950-1250μm During the period, the height distance from the origin of the dispensing head to the solid slurry position is between 2590-3380 μm, and the height distance from the origin of the suction nozzle to the solid crystal position is between 2100-2450 μm. Through multiple experiments, the present invention finds that the baking temperature has a crucial influence on the generation of air bubbles. This technical solution provides a set of heating program, which reduces the baking temperature and lengthens the time, so that the adhesive in the glue spreads evenly On the glass and the bracket, the final yield is high, which greatly improves the problem of unqualified products caused by the generation of air bubbles.

Description

technical field [0001] The invention relates to the technical field of LED lamp sterilization, in particular to a preparation method of a UVC-LED light-emitting device. Background technique [0002] UV refers to ultraviolet rays, and UVC is the C-band of ultraviolet rays, with a wavelength of 100-280nm, but since the wavelength below 200nm is vacuum ultraviolet rays, it can be absorbed by the air, so the wavelength of UVC that can pass through the atmosphere is between 200-275nm. [0003] UV can destroy the DNA (deoxyribonucleic acid) or RNA (ribonucleic acid) molecular structure of microorganisms, making the bacteria dead or unable to reproduce, so as to achieve the purpose of sterilization. Among all ultraviolet rays, UVC, a short-wave ultraviolet ray, has the strongest sterilization effect, so it is widely used in sterilization technology. [0004] LED refers to the way of emitting UVC. For example, traditional ultraviolet lamps have always used mercury lamps to emit lig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/52H01L33/00H01L25/16
CPCH01L25/167H01L33/0095H01L33/48H01L33/483H01L33/52H01L2933/0033H01L2933/005
Inventor 马景鹏
Owner LIANYUNGANG GUANGDING ELECTRONICS
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