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Mortar supply method, mortar supply equipment and crystal bar cutting system

A technology of cutting system and supply method, applied in the direction of stone processing equipment, climate sustainability, final product manufacturing, etc., can solve problems such as poor cutting stability, unreasonable mortar supply, and poor wafer warpage

Active Publication Date: 2020-10-23
XUZHOU XINJING SEMICON TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the mortar supply equipment used for ingot cutting in the related art, in the process of cutting the ingot, due to the unreasonable supply of mortar, the cutting stability is poor, and the warpage of the obtained wafer is not good.

Method used

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  • Mortar supply method, mortar supply equipment and crystal bar cutting system
  • Mortar supply method, mortar supply equipment and crystal bar cutting system

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0043] L 0 =300mm, V 0 =180L, R=70%;

[0044] V 1 =(L-(1-0.7)*300)*180 / (0.7*300)=(L-90)*6 / 7

[0045] V 1 =(L-(1-0.7)*300)*180 / (0.7*300)=(L-90)*6 / 7

[0046] V 2 =(300-L)*180 / ((2-0.7)*300)=(300-L)*6 / 13

[0047] Among them, when inputting different L values, different V can be obtained 1 and V 2 , so that the value of the above-mentioned setting ratio can be adjusted.

example 2

[0049] L 0 =300mm, V 0 =200L, R=60%;

[0050] V 1 =(L-(1-0.6)*300)*200 / (0.6*300)=(L-120)*10 / 9

[0051] V 2 =(300-L)*200 / ((2-0.6)*300)=(300-L)*10 / 21

[0052] Among them, when inputting different L values, different V can be obtained 1 and V 2 , so that the value of the above-mentioned setting ratio can be adjusted.

[0053] According to other embodiments of the present invention, refer to figure 2 , adjust the setting ratio in real time according to the cutting area of ​​the ingot. The cross-section of the ingot is usually circular. When cutting the ingot, it is cut from one radial side of the ingot to the other radial side of the ingot. When cutting the ingot at different positions, the cutting area is different. In the process of ingot cutting, the cutting area first increases and then decreases. The cutting area of ​​the ingot is different, and the required cutting efficiency is different. Thus, the setting ratio can be adjusted in real time according to the cutti...

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Abstract

The invention discloses a mortar supply method, mortar supply equipment and a crystal bar cutting system. The mortar supply equipment comprises a first mixing device, a second mixing device and a finished product mortar mixing and supplying device, and the finished product mortar mixing and supplying device is used for supplying finished product mortar to the crystal bar cutting equipment; the mortar supply method comprises the steps that the set proportion is set according to the cutting efficiency requirement; the first mixing device is controlled to supply a first volume of brand new mortarto the finished mortar mixing and supplying device, the second mixing device is controlled to supply a second volume of recycled mixed mortar to the finished mortar mixing and supplying device, and the ratio of the first volume to the second volume is a set proportion. According to the mortar supply method, the mixing ratio of the brand new mortar to the recycled mixed mortar can be set and adjusted according to the cutting efficiency requirement, and the stability of crystal bar cutting can be improved, so that the warping degree of a wafer obtained by cutting is relatively good.

Description

technical field [0001] The invention relates to the technical field of crystal rod cutting, in particular to a mortar supply method, mortar supply equipment and crystal rod cutting system. Background technique [0002] High-purity crystalline silicon is the main raw material for the preparation of electronic components and solar cells, and is an important electronic information material. In the process of crystalline silicon production, the ingot needs to be cut into wafers, and mortar needs to be used in the process of cutting the ingot. In order to reduce production costs and improve resource utilization, waste mortar is usually recycled, and the recycled mortar is mixed with new mortar for cutting. [0003] However, in the related art mortar supply equipment for crystal ingot cutting, in the process of cutting the crystal ingot, due to the unreasonable supply of mortar, the cutting stability is poor, and the obtained wafer has poor warpage. Contents of the invention ...

Claims

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Application Information

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IPC IPC(8): B28D5/00B28D5/04B28D7/00
CPCB28D5/00B28D5/045B28D5/007B28D5/0058Y02P70/50
Inventor 陈建铭卢健平
Owner XUZHOU XINJING SEMICON TECH CO LTD
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