Easy-to-cut and easy-to-stick double-material hollow solar silicon wafer cutting lining plate and preparation method thereof

A dual-material, solar energy technology, applied in chemical instruments and methods, layered products, synthetic resin layered products, etc., can solve problems such as affecting the silicon crystal cutting process, and achieve easy adhesion, easy identification, and cost savings. Effect

Active Publication Date: 2020-10-09
江阴市嘉宇新材料有限公司
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the embodiment of the present invention provides an easy-to-cut and easy-to-adhesive double-material hollow solar silicon wafer cutting liner and its preparation method to solve the problem that the liners currently on the market have defects and cannot guarantee easy cutting and Easy to stick, which affects the silicon crystal cutting process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Easy-to-cut and easy-to-stick double-material hollow solar silicon wafer cutting lining plate and preparation method thereof
  • Easy-to-cut and easy-to-stick double-material hollow solar silicon wafer cutting lining plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] This embodiment provides an easy-to-cut and easy-to-adhesive double-material hollow solar silicon wafer cutting liner, comprising a B surface layer 1 and an A surface layer 2 arranged on the top of the B surface layer 1, and the B surface layer 1 is uniform along the length direction. A plurality of grooves B are distributed, and a plurality of grooves A corresponding to the grooves B are evenly distributed on the A surface layer 2 , and the grooves B and the grooves A are combined to form a sealed through hole 3 .

Embodiment 2

[0030] On the basis of adopting the technical solution of Example 1, the A surface layer includes the following components calculated by mass percentage: ABS resin 90wt%, cutting adjustment component 9wt%, antioxidant 0.6wt%, lubricant 0.4wt% %. The glue content of the ABS resin is 8wt%, and the preferred acrylocyanide is ABS with medium molecular weight. The cutting adjustment component includes any one or a combination of two or more of polytetrafluoroethylene powder, ultra-high molecular weight polyethylene powder, and polyvinylidene fluoride.

[0031] The surface layer B includes the following components calculated by mass percentage: ABS resin 80wt%, adhesion regulating component 19wt%, antioxidant 0.6wt%, lubricant 0.4wt%. The adhesion regulating component is mineral powder or metal powder, specifically selected from any one or a combination of two or more of calcium carbonate, talc powder, aluminum powder, iron powder and the like. The antioxidant is a compound of ant...

Embodiment 3

[0033] On the basis of adopting the technical solution of Example 1, the A surface layer includes the following components calculated by mass percentage: ABS resin 96wt%, cutting adjustment component 3wt%, antioxidant 0.6wt%, lubricant 0.4wt% %. The glue content of the ABS resin is 13 wt%, and the preferred acrylocyanide is ABS with medium molecular weight. The cutting adjustment component includes any one or a combination of two or more of polytetrafluoroethylene powder, ultra-high molecular weight polyethylene powder, and polyvinylidene fluoride.

[0034] The surface layer B includes the following components calculated by mass percentage: ABS resin 90wt%, adhesion regulating component 9wt%, antioxidant 0.6wt%, lubricant 0.4wt%. The adhesion regulating component is mineral powder or metal powder, specifically selected from any one or a combination of two or more of calcium carbonate, talc powder, aluminum powder, iron powder and the like. The antioxidant is a compound of an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The embodiment of the invention discloses an easy-to-cut and easy-to-stick double-material hollow solar silicon wafer cutting lining plate and a preparation method thereof. The easy-to-cut and easy-to-adhere double-material hollow solar silicon wafer cutting lining plate comprises a surface layer B and a surface layer A arranged at the top of the surface layer B. A plurality of grooves B are evenly distributed in the surface layer B in the length direction, a plurality of grooves A corresponding to the grooves B are evenly distributed in the surface layer A, and the grooves B and the grooves Aare combined to form sealing through holes. In the easy-to-cut and easy-to-stick double-material hollow solar silicon wafer cutting lining plate provided by the invention, the surface layer A is madefrom self-lubricating cutting-resistant resin powder as a cutting regulator, so that the linear vibration is small, and the conditions of oblique cutting and wafer falling are not easy to occur. Thesurface layer B is made from mineral powder or metal powder as a bonding regulator, so that the bonding of the cutting lining plate and the crystal support can be effectively ensured, and rod fallingis avoided. According to the cutting lining plate, a double-material structure is innovatively adopted, the formula is easy to design and adjust, the surface layer A can better achieve the easy-to-cutperformance, and the cutting quality and stability are guaranteed.

Description

technical field [0001] The invention relates to the technical field of solar photovoltaic silicon wafer cutting, in particular to an easy-cut and easy-stick dual-material hollow solar silicon wafer cutting liner and a preparation method thereof. Background technique [0002] Photovoltaic silicon wafer cutting is an important link in the field of solar energy. The cutting efficiency of silicon wafers and the A-piece rate of silicon wafers are important evaluation criteria for the quality of photovoltaic cutting. Photovoltaic silicon wafers are currently mainly cut with diamond wires, double-wire cutting, and multiple pieces at a time. During the cutting process, the silicon rods are adhered to the crystal support, and there will be a liner between the silicon wafer and the crystal support. The function of the liner is to facilitate After the silicon rod is cut through, it will not hurt the crystal holder. [0003] Silicon wafer cutting liners have been made of glass plates, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/30B32B27/18B32B27/06B32B3/30B32B33/00C08L55/02C08L27/18C08L23/06C08L27/16C08K13/02C08K3/26C08K3/34C08K3/08
CPCB32B27/302B32B27/18B32B27/08B32B3/30B32B33/00C08L55/02C08K13/02C08K3/26C08K3/34C08K3/08C08K2003/0812C08K2003/0856C08K2003/265C08L2207/068B32B2250/24C08L27/18C08L23/06C08L27/16
Inventor 宋功品刘雪高夏泉清
Owner 江阴市嘉宇新材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap