A packaging device for a full-spectrum LED packaged light source

A technology for LED packaging and packaging devices, which is applied to semiconductor devices, electrical components, circuits, etc., and can solve problems such as affecting luminous efficiency, poor heat dissipation performance of LED packaging, and inability of light-emitting chips to dissipate heat in time.

Active Publication Date: 2021-04-27
SHENZHEN CHANGFANG GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, most of the existing full-spectrum LED packaged light source packaging devices on the market have the following deficiencies during use: the heat dissipation performance of the LED package is poor, which leads to the failure of the light-emitting chip to dissipate heat in time and affects the luminous efficiency. The packaging device of LED packaged light source is not easy to solve such problems, therefore, there is an urgent need for a packaging device of full-spectrum LED packaged light source to solve the above problems

Method used

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  • A packaging device for a full-spectrum LED packaged light source
  • A packaging device for a full-spectrum LED packaged light source
  • A packaging device for a full-spectrum LED packaged light source

Examples

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Embodiment 1

[0026] refer to Figure 1-3 , a packaging device for a full-spectrum LED packaged light source, comprising a light-emitting chip 11, bumps 12 are fixedly connected to both sides of the bottom outer wall of the light-emitting chip 11, and a silicon carrier 13 is fixedly connected to the bottom outer wall of the bump 12, and the silicon carrier 13 A heat sink 1 is fixed on the bottom outer wall of the heat sink 1 by bolts, and the light-emitting chip 11 is buckled upside down on the top outer wall of the heat sink 1. Both sides of the heat sink 1 are fixed with a base 7 by bolts, and the top outer wall of the heat sink 1 is The lamp cup 10 is clamped, and the lamp cup 10 is covered on the outside of the light-emitting chip 11. The surface of the lamp cup 10 is coated with a phosphor layer, and the same reflective cup is clamped on the top outer walls of the two bases 7, and the top of the reflective cup A lens 8 is fixed on the outer wall by bolts, and the lens 8 is covered on t...

Embodiment 2

[0030] refer to Figure 4, a packaging device for a full-spectrum LED packaged light source. Compared with Embodiment 1, this embodiment further includes a temperature sensor 23 and a controller 24. The temperature sensor 23 is fixed on the bottom outer wall of the cooling plate 5 near the vertical plate 14 by bolts. , the controller 24 is fixed on one side of the outer wall of the base 7 by bolts, the signal output end of the temperature sensor 23 is connected with the signal input end of the controller 24 through the signal line, and the signal output end of the controller 24 is connected with the cooling fan through the signal line. 15 to the signal input terminal.

[0031] When in use, the temperature sensor 23 and the controller 24 are set, and the temperature sensor 23 can set an early warning value. When the heat reaches a certain temperature, the heat dissipation fan 15 is driven to work, thereby accelerating the heat dissipation, and strengthening the heat dissipation...

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Abstract

The invention discloses a packaging device for a full-spectrum LED packaged light source. Aiming at the problem of poor heat dissipation performance and affecting luminous performance, the following solution is proposed, including a light-emitting chip, and both sides of the outer wall of the bottom of the light-emitting chip are fixedly connected with bumps , a silicon carrier is fixedly connected to the bottom outer wall of the bump, a heat sink is fixed on the bottom outer wall of the silicon carrier by bolts, the light-emitting chip is inverted on the top outer wall of the heat sink, and the two outer walls of the heat sink are The bases are fixed by bolts on the top of the heat sink, a lamp cup is clamped on the top outer wall of the heat sink, the lamp cup is covered on the outer side of the light-emitting chip, and the surface of the lamp cup is coated with a phosphor layer. The invention enables the heat to be transformed layer by layer, from heat to mechanical vibration, and then into the energy compressed by the shock-absorbing spring, thereby forming a damping force, and finally dissipating in the atmosphere. The whole process is extremely short, but the heat is quickly dissipated. It makes the cooling effect of the device better and stronger.

Description

technical field [0001] The invention relates to the technical field of packaging devices, in particular to a packaging device for a full-spectrum LED packaged light source. Background technique [0002] LED lights refer to lamps that use light-emitting diodes as light sources. Generally, silver glue or white glue is used to cure semiconductor LEDs on the bracket, and the surroundings are sealed with epoxy resin to protect the internal core wires. Finally, the shell is installed. For full spectrum LED lights need to use better LED packaging, that is, the packaging of light-emitting chips, which can protect the wick and transmit light. [0003] At present, most of the existing full-spectrum LED packaged light source packaging devices on the market have the following deficiencies during use: the heat dissipation performance of the LED package is poor, which leads to the failure of the light-emitting chip to dissipate heat in time and affects the luminous efficiency. A packagin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/58H01L33/60H01L33/62H01L33/64
CPCH01L33/48H01L33/507H01L33/58H01L33/60H01L33/62H01L33/64
Inventor 胡丰森
Owner SHENZHEN CHANGFANG GRP CO LTD
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