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MEMS pressure sensor oil-filled core body and packaging method thereof

A technology of pressure sensors and oil cores, applied in piezoelectric/electrostrictive/magnetostrictive devices, measurement of the property and force of piezoelectric resistance materials, fluid pressure measurement by changing ohmic resistance, etc., can solve the problem of sensor accuracy Reduce, microcircuit fatigue damage and other problems, achieve the effect of less lead wire interconnection, improve high and low temperature precision, and high product reliability

Pending Publication Date: 2020-09-08
WUHAN FINEMEMS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an oil-filled core of a MEMS pressure sensor and a packaging method thereof, which has the advantages of high detection accuracy of the oil-filled core, and solves the problems of temperature measurement modules, signal processing units and The pressure-sensing unit is set on the same working surface. Since the pressure-sensing unit belongs to the weakest area of ​​the sensor chip and continuously deforms with pressure changes, the signal processing unit is also set on this surface, which will cause the microcircuit inside the chip to face the risk of fatigue damage and make the sensor accuracy Lowering the problem

Method used

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  • MEMS pressure sensor oil-filled core body and packaging method thereof
  • MEMS pressure sensor oil-filled core body and packaging method thereof
  • MEMS pressure sensor oil-filled core body and packaging method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0044] see Figure 1-5, a MEMS pressure sensor oil-filled core, including a cover 10, a base 20 and a sensitive component 40; the base 20 is provided with a sensitive component 40; the sensitive component 40 includes a silicon elastic diaphragm 41 and a signal calibration module 42, the silicon elastic membrane Chip 41 and signal calibration module 42 are all arranged on the bare chip, so that both are located on the same horizontal plane; The signal calibration module 42 is located on different planes, and the signal calibration module 42 is located around the silicon elastic diaphragm 41, so as to prevent the stress change of the silicon elastic diaphragm 41 from affecting the signal calibration module 42, causing the circuit in the signal calibration module 42 to be damaged It is beneficial to ensure the accuracy; the principle is that the silicon elastic diaphragm 41 will generate strain under pressure, resulting in different changes in the resistance value of the semicond...

Embodiment 2

[0058] see Figure 6-7 The difference from Embodiment 1 is that there is no back pressure sheet between the patch adhesive 302 and the sensitive component 40, and the center of the patch adhesive 302 is provided with a round hole, and the lower surface of the base 20 is provided with a through hole communicating with the round hole. The hole 510 makes the oil-filled core communicate with the atmospheric environment, so that the measured value relative to the atmospheric pressure can be detected.

[0059] When using:

[0060] (1) The external pressure acts on the pressure diaphragm 12, and the medium 17 filled in the sealed cavity 16 will be squeezed through the pressure diaphragm 12, and then the pressure will be transmitted to the sensitive component 40 by the medium 17, thereby causing silicon elasticity on the sensitive component 40 The change of the diaphragm 41, the pressure of the silicon elastic diaphragm 41 will produce strain, resulting in different changes in the re...

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Abstract

The invention relates to the technical field of pressure sensors, and discloses an MEMS pressure sensor oil filling core which comprises an upper cover, a base and a sensitive assembly. A lower end ofthe upper cover is in sealed connection with the base, the base and the upper cover form a sealed cavity, and the sealed cavity is filled with a detection medium; a sensitive assembly is arranged onthe base and located in the sealed cavity. According to the MEMS pressure sensor oil-filled core and the packaging method thereof, a chip composed of a silicon elastic diaphragm, a semiconductor resistor and signal calibration modules is adopted; a signal processing circuit does not need to be arranged outside, and lead wire interconnection is reduced; the structure is simple, the cost is low, theproduct reliability is high, and convenience of production is achieved; the semiconductor resistor and the signal calibration module are located on different planes, the signal calibration modules are located on the periphery of the silicon elastic diaphragm, the risk that lines in the signal calibration module are damaged due to the fact that stress changes of the silicon elastic diaphragm influence the signal calibration module is prevented, and precision can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of pressure sensors, in particular to an oil-filled core body of a MEMS pressure sensor and a packaging method thereof. Background technique [0002] The main function of the pressure sensor is to convert the external pressure signal into an electrical signal, which is widely used in the fields of automotive electronics, aerospace, petrochemical, medical equipment and consumer electronics. [0003] As the core device of the pressure sensor, the pressure chip can be mainly divided into diffused silicon piezoresistive, capacitive, piezoelectric, resonant and other pressure sensors; among them, the diffused silicon pressure sensor chip adopts advanced MEMS technology and is formed by etching technology. Pressure-sensitive pressure diaphragm, the pressure-sensitive element is made in the pressure-sensitive pressure diaphragm area by ion implantation; in addition, the MEMS pressure sensor is small in size, light ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L9/06G01L1/18B81C1/00B81B7/02B81B7/00
CPCG01L9/06G01L1/18B81B7/02B81B7/0032B81C1/00261B81B2201/0264
Inventor 王小平曹万李凡亮王红明施涛吴登峰李兵
Owner WUHAN FINEMEMS
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