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Epoxy structural adhesive with high elongation at break and preparation method thereof

A technology of epoxy structural adhesive and adhesive, applied in the direction of epoxy resin adhesive, adhesive, adhesive additive, etc., can solve the problems of reduced bonding strength of materials, shortened service life, difficult process control, etc., to achieve good shearing , cost reduction, good transparency and anti-aging properties

Inactive Publication Date: 2020-09-08
三友(天津)高分子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Commonly used epoxy resin structural adhesives are hard and brittle after curing, with poor toughness, and the internal stress generated by curing is likely to cause cracks in the adhesive layer, which will easily lead to a reduction in the bonding strength and service life of the material. reduction
At present, most of the epoxy structural adhesives with high elongation at break in the market are two-component, the formula is complicated, and the process is not easy to control

Method used

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  • Epoxy structural adhesive with high elongation at break and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0022] (1) Place 20% by weight epoxy resin E51 and 35% nano-core-shell modified resin in an oven at 50-80°C for 20-40 minutes and stir twice to make the materials evenly mixed.

[0023] (2) Add 15% didecyl phthalate, 5% dioctyl phthalate, 2% fumed white carbon black, and 16% heavy calcium carbonate to the above mixed material. , 3% dicyandiamide curing agent, 2% zinc oxide, 2% pigment, initially mixed.

[0024] (3) Mix 3-4 times on the three-roll mill to make the materials fully mixed evenly. During this period, control the temperature of the three-roll mill rolls below 40°C, and visually observe that the materials are uniform and free of particles, and the materials are discharged.

[0025] (4) Place the above-mentioned mixed materials in a vacuum degassing machine at a speed of 2000-3000r / min for 180-300 seconds, and discharge the material to obtain the adhesive.

[0026] Prepare samples according to customer test standards, and test after baking at 170°C for 20 minutes.

specific Embodiment 2

[0028] (1) Place 20% epoxy resin E51, 5% epoxy resin E44, 20% nano core-shell modified resin, and 10% liquid nitrile rubber in an oven at 50-80°C for heating 20-40 minutes, use a spatula to stir every ten minutes to make the ingredients evenly mixed.

[0029] (2) Add 11% didecyl phthalate, 4% dioctyl phthalate, 2% fumed white carbon black, and 26% heavy calcium carbonate to the above mixed material. , 4% silica powder, 3% dicyandiamide curing agent, 3% zinc oxide, 2% pigment, initially mixed.

[0030] (3) Mix 3-4 times on the three-roll mill to make the materials fully mixed evenly. During this period, control the temperature of the three-roll mill rolls below 40°C, and visually observe that the materials are uniform and free of particles, and the materials are discharged.

[0031] (4) Place the above-mentioned mixed materials in a vacuum degassing machine at a speed of 2000-3000r / min for 180-300 seconds, and discharge the material to obtain the adhesive.

[0032] Prepare sa...

specific Embodiment 3

[0034] (1) Put 22% epoxy resin E51 and 20% nano-core-shell modified resin by weight in an oven at 50-80°C for 20-40 minutes and stir with a spatula every ten minutes. Mix the ingredients well.

[0035] (2) Add 12% didecyl phthalate, 5% dioctyl phthalate, 3% polybutadiene, and 3% fumed silica to the above mixed material. , 18% of heavy calcium carbonate, 10% of polyvinyl chloride paste resin, 1.5% of dicyandiamide curing agent, 0.5% of acid anhydride curing agent, 3% of zinc oxide, 2% of pigment, preliminary mixing.

[0036] (3) Mix 3-4 times on the three-roll mill to make the materials fully mixed evenly. During this period, control the temperature of the three-roll mill rolls below 40°C, and visually observe that the materials are uniform and free of particles, and the materials are discharged.

[0037] (4) Place the above-mentioned mixed materials in a vacuum degassing machine at a speed of 2000-3000r / min for 180-300 seconds, and discharge the material to obtain the adhesiv...

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Abstract

The invention discloses an epoxy structural adhesive with high elongation at break and a preparation method thereof. The epoxy structural adhesive is composed of the following raw materials in percentage by weight: 20-30% of epoxy resin, 10-20% of a plasticizer, 20-35% of a flexibilizer, 15-25% of filler, 2-5% of a curing agent and 1-5% of an accelerant. The epoxy structural adhesive with high elongation at break is obtained by mixing the materials according to a certain ratio, rolling by a three-roller open mill at normal temperature, and defoaming by a vacuum defoamer. The elongation at break of the cured epoxy structural adhesive reaches 10% or above, the tensile strength can reach 15 MPa, and the cured epoxy structural adhesive has high elongation at break and tensile strength while meeting the requirements for conventional shearing and peeling strength. The bonding requirements of high-deformation and high-strength parts of airplanes, automobiles, mechanical structural parts and the like can be met.

Description

technical field [0001] The invention relates to the technical field of epoxy resin adhesives, in particular to an epoxy structural adhesive with high elongation at break and a preparation method thereof, which can be widely used in the bonding of mechanical structural parts in fields such as aircraft and automobiles. catch. Background technique [0002] Structural adhesives are suitable for high-strength bonding and sealing parts, which can improve the strength and shock absorption of the car body, and at the same time can effectively reduce the weight of the vehicle and improve the overall performance of the vehicle. [0003] Epoxy resin structural adhesive is an adhesive with good bonding performance, high bonding strength, excellent durability, and good bonding performance to metal materials. [0004] Commonly used epoxy resin structural adhesives are hard and brittle after curing, with poor toughness, and the internal stress generated by curing is likely to cause cracks...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/00C09J201/00C09J109/02C09J127/06C09J11/04C09J11/06C09J11/08
CPCC08K2003/2296C08K2003/265C08L2201/08C08L2205/03C08L2205/035C08L2207/53C09J11/04C09J11/06C09J11/08C09J163/00C09J201/00C08L63/00C08K13/02C08K5/12C08K3/36C08K3/26C08K3/22C08L101/00C08L9/02C08L27/06C08L23/20
Inventor 陈雨李程吴子刚赵苗梁玉才
Owner 三友(天津)高分子技术有限公司
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