Processing method of sound hole of MEMS carrier plate

Abstract

The invention discloses a processing method of a sound hole of an MEMS carrier plate. The method comprises the following steps: preparing an MEMS carrier plate, wherein the MEMS carrier plate comprises a core plate formed by laminating and compounding two inner copper layers and an inner insulating layer, two first copper layers laminated on the surfaces of the two inner copper layers through a first insulating layer respectively, and two second copper layers laminated on the surfaces of the two first copper layers through a second insulating layer respectively; performing laser windowing on the second copper layers to form a window capable of exposing a local surface of the second insulating layer; performing laser ablation grooving on the exposed surface area of each second insulating layer, and processing a blind groove capable of penetrating through the second insulating layer and the first insulating layer; and carrying out laser hole cutting on the MEMS carrier plate and at the position corresponding to the bottom of the blind groove, and processing a sound hole with one end communicated with the blind groove and the other end penetrating through the other second copper layer. The sound hole processing method has the advantages of being simple, easy to operate, high in operation precision, high in machining efficiency and the like, and the sound hole quality is guaranteed.

Description

technical field [0001] The invention relates to the technical field of circuit board production, and specifically provides a method for processing an acoustic hole of a MEMS carrier board. Background technique [0002] With the development of electronic technology and people's requirements for miniaturization and high integration of electronic products, in order to reduce the volume of the carrier board and increase the utilization rate of space, blind slot products have emerged as the times require. [0003] In the existing technology, the processing technology of blind groove and sound hole mainly adopts: the first processing technology: first perform mechanical drilling (sound hole) operation, then perform laser groove window opening operation, and then perform CO2 laser groove burning operation; or , the second processing technology: first carry out the laser groove window opening operation, then carry out the CO2 laser groove burning operation, and then carry out the X-...

AI Technical Summary

Problems solved by technology

[0004] However, for the above-mentioned first processing technology, when the designed sound hole is located at the blind groove, then when performing laser grooving, because there are through holes (acoustic holes) in the area where the groove needs to be burnt, the energy will pass through the through hole and damage the Hole wall, which affects the quality of the sound hole

For the above-mentioned second processing technology, because the sound hole adopts two drilling operations, on the one hand, it will cause the accuracy of the sound hole and the graphics to deteriorate, and on the other hand, it will increase the process, resulting in cost waste

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