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Method and apparatus for effectively producing trifluoroamine oxide

An oxide and trifluoroamine technology, applied in the field of effectively preparing trifluoroamine oxide, can solve the problems of uncertainty, synthesis method risk, yield and gas purity are not fully recognized, etc., to reduce the reaction time, The effect of improving raw yield, high yield and purity

Active Publication Date: 2020-07-31
KOREA RES INST OF CHEM TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

By using SbF 5 / NF 3 / N 2 Synthesis of F from O system 3 In the case of NO, the synthesis method has not been fully recognized in terms of risk, yield and gas purity, so its commercialization is still uncertain

Method used

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  • Method and apparatus for effectively producing trifluoroamine oxide
  • Method and apparatus for effectively producing trifluoroamine oxide

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preparation example Construction

[0025] In one aspect of the present invention, the present invention provides the preparation method of trifluoroamine oxide, it comprises the following steps:

[0026] In the presence of a reaction catalyst, the intermediate product is produced by reacting nitrogen trifluoride with nitrous oxide, wherein the nitrogen-containing gas (N 2 ) of unreacted gas is removed and instead additional injection of nitrogen trifluoride and nitrous oxide; and

[0027] Trifluoroamine oxide is produced by reacting this intermediate product with sodium fluoride.

[0028] The trifluoroamine oxide (F) provided by one aspect of the present invention will be described in detail step by step below. 3 NO) preparation method.

[0029] First, the preparation method of trifluoroamine oxide provided according to one aspect of the present invention comprises the following steps: in the presence of a reaction catalyst, an intermediate product is produced by reacting nitrogen trifluoride with nitrous oxi...

Embodiment 1

[0079] Step 1: 200 grams (0.92 moles) of antimony pentafluoride (SbF 5 ) into a stainless steel 1-liter high-pressure reactor and use the internal F 2 Gas passivation, the high pressure reactor was equipped with magnetic drive, anchor stirrer and jacket. Add 130.6 g (1.84 mol) of nitrogen trifluoride (NF 3 ) and 80.96 grams (1.84 moles) of nitrous oxide (N 2 O), and tightly seal the reactor. The stirring speed was maintained at 200 rpm and the reaction temperature was increased to 150°C.

[0080] Reaction progress such as reaction conversion was followed by gas chromatography TCD and 5% fluorocol / carbopack B column to track the N produced in the reaction 2 Monitor with consumption of nitrogen trifluoride and nitrous oxide. When the average conversion rate of antimony pentafluoride based on nitrogen trifluoride and nitrous oxide reaches 70%-80%, the reaction gas N 2 / NF 3 / N 2 O is removed and pure nitrogen trifluoride and nitrous oxide are injected. Gas venting and ne...

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Abstract

Disclosed is a method for producing trifluoroamine oxide, the method comprising: a step for producing an intermediate product by reacting nitrogen trifluoride and nitrous oxide in the presence of a reaction catalyst, wherein unreacted gas including nitrogen (N2) generated by the reaction is removed, and nitrogen trifluoride and nitrous oxide are further injected to produce the intermediate product; and a step for producing trifluoroamine oxide by reacting the intermediate product with sodium fluoride.

Description

technical field [0001] The present invention relates to methods and apparatus for the efficient preparation of trifluoroamine oxides. Background technique [0002] A thin film manufacturing method, such as semiconductor manufacturing, is widely known as a CVD (Chemical Vapor Deposition) method. In the case of forming a thin film such as a semiconductor in a CVD chamber, it is preferable to form the thin film on the designated area and target object in the CVD chamber, however the film forming material will unnecessarily deposit on other exposed surfaces in the CVD chamber superior. For example, material can be deposited on the surface of the inner wall of the chamber, product holding fixtures and pipelines, etc. Furthermore, accumulated material outside the target can cause short circuits during the deposition process. These short-circuiting materials or particles can contaminate the formed target or the film to be formed on the surface of the target. These problems degr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B21/084
CPCB01D3/101B01D3/106C01B21/0842B01J10/007B01J19/0013B01J19/0066
Inventor 姜弘锡朴仁濬李寿福苏源郁陆信洪孙银晧金凡植郭正勋权柄香
Owner KOREA RES INST OF CHEM TECH
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