High-volume diamond reinforced metal-based composite material and preparation method and application thereof

A diamond-reinforced composite material technology, applied in the field of thermal management composite material preparation, can solve the problem of low diamond content, achieve the effects of improving thermal conductivity, maintaining thermal conductivity, and improving wettability

Active Publication Date: 2020-07-31
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007]The object of the present invention is to overcome the defect that the diamond content in the diamond-reinforced composite material deposited by the existing chemical vapor deposition technology is too low, and to provide a high-volume diamond-reinforced Metal matrix composite materials and their preparation methods and applications; a high thermal conductivity diamond reinforcement is constructed by chemical vapor deposition technology, compounded with a metal matrix to prepare a composite material, and then a pure diamond layer is deposited on the surface of the composite material by chemical vapor deposition to improve the composite material. The volume of diamond in the material can greatly improve the thermal conductivity. At the same time, due to the uniform hardness of the pure diamond layer, it is easier to process and more convenient to apply in various fields.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] Example 1 High-volume diamond-reinforced copper-based composite material (the reinforcement configuration is a three-dimensional network configuration)

[0085] (1) Substrate pretreatment: In this example, the three-dimensional network configuration adopts copper with an aperture of 0.25mm, a diameter of 12.3mm, and a thickness of 2.0mm as the substrate. Firstly, according to step (2), the copper foil substrate of the three-dimensional network configuration is cleaned, and then according to step (2), a chromium film with a thickness of 50 nm is deposited on the surface of the copper skeleton of the three-dimensional network configuration by magnetron sputtering as an intermediate transition layer.

[0086] (2) Mix the nanocrystals and the metal skeleton substrate in (1) in a beaker, heat to boiling, and then vibrate in a high-power ultrasonic wave. After the dispersion is uniform, take out the three-dimensional continuous network metal skeleton substrate and dry it. A ...

Embodiment 2

[0093] Example 2 High-volume diamond-reinforced copper-based composite material (reinforcement configuration is the coupling of three-dimensional network configuration and zero-dimensional particle configuration)

[0094](1) (Pretreatment of the substrate: In this example, the three-dimensional network configuration uses copper with an aperture of 0.25 mm, a diameter of 12.3 mm, and a thickness of 2.0 mm as the substrate, and natural diamond particles with an average size of 50 μm in the zero-dimensional particle configuration. Firstly, according to step (2), the three-dimensional network substrate of the metal copper framework is cleaned, and then according to step (2), a chromium film with a thickness of 50 nm is deposited on the surface of the copper three-dimensional network framework by magnetron sputtering technology as an intermediate transition layer.

[0095] (2) Mix the nanocrystalline grains and the three-dimensional metal framework substrate in (1) in a beaker, heat...

Embodiment 3

[0104] Example 3 High-volume diamond-reinforced titanium-based composite material (the metal matrix is ​​a titanium-zirconium alloy, and the reinforcement configuration is the coupling of a three-dimensional network configuration and a zero-dimensional particle configuration)

[0105] (1) Substrate pretreatment: In this example, the three-dimensional network configuration uses copper with a pore size of 0.20 mm, a diameter of 12 mm, and a thickness of 2.0 mm as the substrate, and natural diamond particles with an average size of 50 μm in the zero-dimensional particle configuration. Firstly, according to step (2), the three-dimensional network substrate of the metal copper framework is cleaned, and then according to step (2), a chromium film with a thickness of 50 nm is deposited on the surface of the copper three-dimensional network framework by magnetron sputtering technology as an intermediate transition layer.

[0106] (2) Mix the nanocrystalline grains and the three-dimensi...

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PUM

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Abstract

The invention discloses a high-volume diamond reinforced metal-based composite material and a preparation method and application thereof. The high-volume diamond reinforced metal-based composite material comprises a gradient boron-doped diamond reinforced metal-based composite material and a diamond layer strengthening phase, wherein the diamond layer strengthening phase coats the surface of the gradient boron-doped diamond reinforced metal-based composite material; the gradient boron-doped diamond reinforced metal-based composite material comprises a gradient boron-doped diamond reinforcementbody and a metal matrix; and the gradient boron-doped diamond reinforcement body comprises an undoped diamond reinforcement body and a gradient boron-doped diamond modified layer arranged on the surface of the diamond reinforcement body. According to the material, the preparation method and application thereof, the thermal conductivity is greatly improved by increasing the volume of diamond in the composite material, and meanwhile, due to the fact that a pure diamond layer is uniform in hardness, the pure diamond layer is easier to machine, and is more conveniently applied to various fields.

Description

technical field [0001] The invention relates to a preparation method and application of a high-volume diamond-reinforced metal matrix composite material, and belongs to the technical field of thermal management composite material preparation. Background technique [0002] With the continuous development of information technology, the 5G network is affecting social life more and more deeply. While realizing intelligence, electronic products are gradually developing towards thinner, high-performance and multi-functional directions, which greatly increases the integration of electronic products. And assembly density, the increasing integration and assembly density of electronic products lead to a sharp increase in power consumption and heat generation, and heat dissipation will become an urgent problem for electronic equipment. In addition, the digital and intelligent development in the fields of national defense and military industry (such as radar systems, infrared detectors,...

Claims

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Application Information

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IPC IPC(8): C23C16/27C23C16/02C23C16/56C22C26/00
CPCC23C16/278C23C16/0272C23C16/56C22C26/00
Inventor 魏秋平周科朝马莉康翱龙
Owner CENT SOUTH UNIV
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