Method for manufacturing normal-mode spiral dipole electronic tag yarn

Abstract

The invention discloses a method for manufacturing normal-mode spiral dipole electronic tag yarn. A pair of rectangular conductive bridge islands are printed at a fixed interval on a flexible narrow band to prepare a bridging component; RFID tag chips are assembled on the rectangular conductive bridge islands of the bridging component in a point-to-point manner; a pair of conductive fibers with acertain length are symmetrically fixed to the rectangular conductive bridge islands of the bridging component by using an anisotropic conductive adhesive; assembly points among the conductive fibers,RFID tags and the rectangular conductive bridge islands are coated and encapsulated by using a flexible insulating adhesive to form yarn-shaped linear dipole tag middleware; and the yarn-shaped lineardipole tag middleware is wound onto non-conductive carrier yarn at a certain coating degree, and the two pieces of non-conductive yarn are oppositely wrapped outwards to form the normal-mode spiral dipole electronic tag yarn. The preparation method is simple, the process flow is short, technical problems of the prior art are overcome, the production cost is reduced, and standardization and industrial production requirements are met.

Description

technical field [0001] The invention relates to a method for manufacturing a normal-mode spiral dipole electronic label yarn, in particular to a continuous production method for a normal-mode spiral dipole electronic label yarn, and belongs to the technical field of RFID label yarns. Background technique [0002] Compared with traditional information labels such as barcodes and two-dimensional codes, RFID tags have the advantages of strong environmental adaptability and multiple simultaneous reading. In order to realize the intelligent management of textiles, improve the timeliness and accuracy of informatization, and reduce labor costs, RFID tags are in great demand in textile warehouse logistics management and clothing anti-counterfeiting. The labels currently applied to fabrics are mainly large-area two-dimensional fabric-based RFID labels such as embroidery labels and screen printing labels. Although such labels have the advantages of being wearable and washable, they ha...

AI Technical Summary

Problems solved by technology

If the FLIP CHIP type RFID tag chip is used, the requirements for packaging equipment are high, the packaging is difficult, and the packaging success rate is low; if the SMD type RFID tag chip is used, the conductive yarn / fiber is wound on the lead angle of the RFID tag chip, and the RFID The label production capacity is low, which is not conducive to the process industrial production of label yarn

At the same time, the cost of SMD-type RFID tag chips is relatively high compared to the profits of the textile industry, which is not conducive to the commercialization of RFID tags.

[0004] Therefore, although the existing RFID tag yarn meets the requirements of invisible anti-theft, good softness, and little impact on wearing performance, the traditional automatic roll-to-roll binding process is not suitable for large-diameter flexible conductive fibers and small-sized chip contact pads. In the preparation process, because the connection and packaging between the RFID tag chip and the conductive fiber is difficult, the existing research samples often use the packaged chip to start manual sample preparation, and the RFID tag yarn preparation process is complicated, the production efficiency is low, and it is not compatible. A series of problems such as the yarn production process, the roll-to-roll automatic production process technology that meets the requirements of the normal mode spiral dipole RFID tag yarn has not yet been established

Images