Polyimide composite material and preparation method thereof and substrate

A technology of polyimide and composite materials, which is applied in the field of polyimide composite materials and their preparation methods and substrate substrates, can solve the problems that the performance is difficult to meet the comprehensive performance standards, and achieve the improvement of mechanical properties and thermal stability Sex, good bending resistance, enhanced compatibility

Pending Publication Date: 2020-07-10
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Conventional polyimide materials have a denser rigid structure and strong intermolecular interactions, while pure polyimide is rarely used in production at present, because it is difficult to meet the comprehensive performance standards in all aspects, such as , the tensile properties of pure PI can only reach about 10%, which will limit the application in some fields, such as the PI required in the fields of storage and display has high heat resistance (560 ° C weight loss 1wt%), fracture The stress should be 350MPa, and the elongation at break should be over 15%. Because the structure can be adjusted very well, the preparation of reinforced composite polyimide has become more and more concerned in the application field.

Method used

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  • Polyimide composite material and preparation method thereof and substrate
  • Polyimide composite material and preparation method thereof and substrate
  • Polyimide composite material and preparation method thereof and substrate

Examples

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preparation example Construction

[0047] The present invention also provides a kind of preparation method of described polyimide composite material, polyimide composite material described in the present invention can be prepared by this method, and described preparation method comprises the following steps:

[0048] S1. Polymerizing diamine and dianhydride to obtain a polyamic acid solution;

[0049] S2. Introducing inorganic nanoparticles into the polyamic acid solution to obtain a polyamic acid / inorganic nanoparticle mixed solution; and,

[0050] S3, cross-linking and curing the polyamic acid / inorganic nanoparticle solution to obtain a polyimide composite material;

[0051] The molecular structural formula of the polyimide composite material includes polyimide structural units and inorganic nanoparticles connected to the polyimide structural units in a chemical bond.

[0052] In a nutshell, the three preparation steps of the polyimide composite material can be summarized as follows: 1) preparation of polyam...

Embodiment 1

[0085] In this example, compound A uses diamine-bis(3-aminophenyl)-3,5-bis(trifluoromethyl)phenylphosphine oxide, and compound B uses 4,4'-biphenyl ether dianhydride , the inorganic nanoparticles are magnesium oxide nanoparticles, the compound D is magnesium ethoxide, and the aprotic solvent is a mixture of N,N-dimethylcaproamide (DMAC) and N-methylpyrrolidone (NMP), And DMAC / NMP=v / v=0.2-2, so as to prepare the polyimide composite material.

[0086]Weigh 1.5-10 mmol of diamine-bis(3-aminobenzene)-3,5-bis(trifluoromethyl)phenylphosphine oxide, dissolve in the aprotic solvent and stir evenly to obtain the first reaction solution ; Weighing 1.5-17 mmol of 4,4'-biphenyl ether dianhydride dissolved in the aprotic solvent and stirring uniformly to obtain a second reaction solution; adding the second reaction solution to the first reaction solution, Stir at room temperature for 24-96 hours to make it fully dissolve; then, perform suction filtration under a vacuum environment, and th...

Embodiment 2

[0094] The biggest difference from Example 1 is that in this example, 3,3',4,4'-biphenyltetracarboxylic dianhydride was selected as the compound B for synthesizing the polyimide composite material. In this embodiment, the reaction scheme for preparing the polyimide composite material is shown in the following formula:

[0095] as well as

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Abstract

The invention provides a polyimide composite material and a preparation method thereof and a substrate. Inorganic nanoparticles are connected with a polyimide structural unit in a chemical bond mannerso that the compatibility of the inorganic nanoparticles and the polyimide structural unit is enhanced; meanwhile, the mechanical property and the thermal stability of the polyimide composite material can be effectively improved due to the enhancement effect of the inorganic nanoparticles.

Description

technical field [0001] The invention relates to the technical field of functional materials, in particular to a polyimide composite material, a preparation method thereof, and a base substrate. Background technique [0002] Conventional polyimide materials have a denser rigid structure and strong intermolecular interactions, while pure polyimide is rarely used in production at present, because it is difficult to meet the comprehensive performance standards in all aspects, such as , the tensile properties of pure PI can only reach about 10%, which will limit the application in some fields, such as the PI required in the fields of storage and display has high heat resistance (560 ° C weight loss 1wt%), fracture Stress of 350MPa and elongation at break of 15% or more are required. Because the structure is highly adjustable, the preparation of reinforced composite polyimide has become more and more concerned in the application field. [0003] Therefore, there is an urgent need ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K3/22C08G73/10G09F9/30
CPCC08K3/22C08G73/1071C08G73/1067C08G73/1057C08G73/1039C08G73/1053G09F9/301C08K2201/011C08K2003/222C08L79/08Y02E10/549
Inventor 汪亚民
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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