Internal demolding agent for epoxy resin LED packaging material, and preparation method thereof

Abstract

The invention relates to an internal demolding agent for an epoxy resin LED packaging material, and a preparation method of the internal demolding agent. The demolding agent is prepared by carrying out an addition reaction on the following raw materials in parts by weight: 100-15 parts of low-hydrogen silicone oil, 100-200 parts of an olefin compound and a platinum catalyst based on Pt, wherein the dosage of the platinum catalyst is 5-20 ppm of the total amount of the low-hydrogen silicone oil and the olefin compound. According to the invention, the demolding agent can be directly added into acuring agent of an epoxy resin LED packaging material as an additive and is kept stable, has good compatibility and transparency with the epoxy resin curing agent, can ensure the demolding effect between the epoxy resin curing product and the mold, and especially has the characteristics of convenient use, easy removal of the packaging material, good integrity and the like when being used as the internal demolding agent of the epoxy resin LED packaging material.

Description

Technical field [0001] The invention belongs to the technical field of polymer materials, and specifically relates to an internal release agent for epoxy resin LED packaging materials and a preparation method thereof. Background technique [0002] Epoxy resin has excellent mechanical properties, heat resistance, electrical properties, and chemical corrosion resistance, and is widely used in the electronics industry as a packaging material. Because epoxy resin has excellent bonding properties, it will adhere closely to the mold surface during the curing and molding process, and it is easy to damage the mold surface and the surface of the molded product during the removal process. Therefore, it is necessary to use a release agent to increase the release effect and protect the surface of the mold and the molded product. [0003] Release agents are mainly divided into two types: external release agents and internal release agents, mainly silicone series, wax series, polyether series a...

AI Technical Summary

Problems solved by technology

But this method has the following defects: 1) The first step is to drop styrene into tetramethyltetrahydrocyclotetrasiloxane (D4H) and heat up to 100-140°C to react

Since the boiling point of tetramethyltetrahydrocyclotetrasiloxane is 134°C and the boiling point of styrene is 146°C, when the reaction temperature is above 135°C, boiling may occur, resulting in the lack of reaction raw materials and unstable products

2) Due to the large steric hindrance of the tetramethyltetrahydrocyclotetrasiloxane reactive group, this method requires the use of a high-concentration catalyst for catalysis, and every 100 parts of tetramethyltetrahydrocyclotetrasiloxane needs to be added in terms of Pt The platinum catalyst (chloroplatinic acid) is 0.3-0.4 parts, which is expensive; at the same time, a black precipitate "platinum black" will be generated during the reaction process, and the post-processing is troublesome

3) The reaction conditions are relatively harsh, the reaction temperature is high, up to 140°C, and nitrogen protection must be used

4) The intermediate product of tetramethylalkylphenyl cyclotetrasiloxane and styrene produced in the second step is more difficult due to the addition of benzene ring, which makes the intermediate product more steric hindrance and lower reactivity.

5) The long-chain alkylphenyl hydrogen-containing silicone oil release agent prepared by this method neither stated nor recorded whether it can be used as an internal release agent, nor whether it is suitable for epoxy resin LED packaging materials, and can solve the problem of Its compatibility with epoxy resin

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