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Electroless nickel-phosphorus-cobalt plating bath, and electroless nickel-phosphorus-cobalt plating film

A technology of electroless nickel plating and nickel salt, which can be used in liquid chemical plating, coating, printed circuit manufacturing, etc., and can solve problems such as insufficient wear resistance

Pending Publication Date: 2020-06-16
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In recent years, coatings with excellent wear resistance have been demanded, but conventional electroless nickel-phosphorus coatings have sufficient hardness (Vickers hardness of 650 or higher), but have insufficient wear resistance.

Method used

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  • Electroless nickel-phosphorus-cobalt plating bath, and electroless nickel-phosphorus-cobalt plating film
  • Electroless nickel-phosphorus-cobalt plating bath, and electroless nickel-phosphorus-cobalt plating film
  • Electroless nickel-phosphorus-cobalt plating bath, and electroless nickel-phosphorus-cobalt plating film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～21、 comparative example 1～9

[0072] (Preparation of plating bath)

[0073] Nickel(II) sulfate hexahydrate as a water-soluble nickel salt; sodium hypophosphite as a reducing agent; lead(II) acetate trihydrate as a heavy metal compound; cobalt(II) sulfate heptahydrate as a cobalt-containing compound ; propynyl alcohol ethoxylate, potassium iodate or nitrobenzene as an oxidizing agent; glycine as a complexing agent; By stirring, the plating baths of Examples 1-21 and Comparative Examples 1-9 were prepared. In addition, the temperature of the plating bath was set to 90 degreeC, and pH was set to 6.8.

[0074] (plating treatment)

[0075] Next, the SPCC-SB plate (size: 50mm×50mm, thickness: 4mm) as the object to be plated was immersed in the prepared plating bath for 120 minutes, and an electroless nickel-plated plate with a thickness of 25 μm was formed on the object to be plated. Phosphorus-cobalt film.

[0076] (Composition Analysis of Coating Film)

[0077] Next, the composition of the formed plating ...

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Abstract

An electroless nickel-phosphorus-cobalt plating bath contains a water-soluble nickel salt, a hypophosphorous acid salt, a cobalt-containing compound and a heavy metal compound, and additionally contains at least one component selected from the group consisting of an acetylene compound, an iodide ion source or an iodic acid ion source, and a nitro-group-containing aromatic compound that contains atleast one nitro group. The concentration of the acetylene compound is 10 to 120 mg / L, the concentration of the iodide ion source or the iodic acid ion source is 10 to 4000 mg / L, and the concentrationof the nitro-group-containing aromatic compound is 0.1 to 5000 mg / L.

Description

technical field [0001] The invention relates to an electroless nickel-phosphorus-cobalt bath and an electroless nickel-phosphorus-cobalt film. Background technique [0002] So far, in the field of electronic components, electroless nickel plating films have been formed on aluminum or copper patterns on flexible substrates or silicon wafer substrates. [0003] Unlike the electroplating method, the electroless nickel plating method is a method that can form a metallic nickel film on the surface of the object to be plated only by immersing the object to be plated in a plating bath, and can obtain a uniform thickness regardless of the shape and type of the material. Therefore, it is suitable for plating processing of parts with complex shapes or precision parts. [0004] In recent years, a plating film excellent in wear resistance has been demanded, but the conventional electroless nickel-phosphorus plating film has sufficient hardness (Vickers hardness of 650 or more), but has...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/50H05K3/18
CPCH05K3/18C23C18/50
Inventor 佐藤雅亮黑坂成吾
Owner C UYEMURA & CO LTD
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