Chemical polishing solution for precision copper alloy workpieces

A chemical polishing and copper alloy technology, which is applied in the field of chemical polishing liquid, can solve the problems of poor polishing brightness and fast corrosion speed of copper alloy surface, etc., and achieve the effect of slowing down corrosion, reducing corrosion speed, and slowing down corrosion speed

Active Publication Date: 2020-06-02
惠州宇盛机械设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the deficiencies in the prior art, the object of the present invention is to provide a copper alloy chemical polishing solution, which mainly solves the problems of fast corrosion of the copper alloy surface and poor polishing brightness in the prior art.

Method used

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  • Chemical polishing solution for precision copper alloy workpieces

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Effect test

Embodiment 1

[0018] A chemical polishing solution for precision copper alloy workpieces, made of the following raw materials in parts by weight: 1200 parts of 85wt% phosphoric acid, 500 parts of 98wt% sulfuric acid, 10 parts of aluminum phosphate, 30 parts of potassium persulfate, diphenylthiourea 0.5 part, 5 parts of corrosion inhibitor, described corrosion inhibitor is the mixture of 2-ethyl-3,5-dimethylpyrazine, thiourea, sorbitol and sulfosalicylic acid, and the mass ratio of four is 1 :1:3:10. The preparation method of the copper alloy chemical polishing liquid is as follows: uniformly mixing phosphoric acid and sulfuric acid, then adding other raw materials and stirring uniformly.

Embodiment 2

[0020] A chemical polishing solution for precision copper alloy workpieces, made of the following raw materials in parts by weight: 1000 parts of 85wt% phosphoric acid, 350 parts of 98wt% sulfuric acid, 3 parts of aluminum phosphate, 10 parts of potassium persulfate, diphenylthiourea 0.1 part, 3 parts of corrosion inhibitor, described corrosion inhibitor is the mixture of 2-ethyl-3,5-dimethylpyrazine, thiourea, sorbitol and sulfosalicylic acid, the mass ratio of four is 1 :3:5:8. The preparation method of the copper alloy chemical polishing liquid is as follows: uniformly mixing phosphoric acid and sulfuric acid, then adding other raw materials and stirring uniformly.

Embodiment 3

[0022] A chemical polishing solution for precision copper alloy workpieces, made of the following raw materials in parts by weight: 1000 parts of 85wt% phosphoric acid, 400 parts of 98wt% sulfuric acid, 5 parts of aluminum phosphate, 20 parts of potassium persulfate, diphenylthiourea 0.3 part, 4 parts of corrosion inhibitor, described corrosion inhibitor is the mixture of 2-ethyl-3,5-dimethylpyrazine, thiourea, sorbitol and sulfosalicylic acid, and the mass ratio of four is 1 :2:4:7. The preparation method of the copper alloy chemical polishing liquid is as follows: uniformly mixing phosphoric acid and sulfuric acid, then adding other raw materials and stirring uniformly.

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Abstract

The invention discloses a chemical polishing solution for precision copper alloy workpieces. The chemical polishing solution is prepared from the following raw materials in parts by weight: 1000 to 1200 parts of 85 percent by weight phosphoric acid, 350 to 500 parts of 98 percent by weight sulfuric acid, 3 to 10 parts of aluminum phosphate, 10 to 30 parts of potassium peroxodisulfate, 0.1 to 0.5 part of diphenylthiourea and 3 to 5 parts of corrosion inhibitor, wherein the corrosion inhibitor is a mixture of 2-ethyl-3-5-dimethylpyrazine, thiourea, sorbitol and sulfosalicylic acid in a mass ratio of 1 to (1 to 3) to (3 to 5) to (5 to 10). Compared with the prior art, the copper alloy chemical polishing solution provided by invention is environmentally friendly, is free from yellow smoke, islow in corrosion rate, can achieve a bright mirror effect, and is particularly suitable for polishing copper alloy precision parts with strict size requirements.

Description

technical field [0001] The invention belongs to the field of metal surface treatment, in particular to a chemical polishing liquid for precision copper alloy workpieces. Background technique [0002] Copper and copper alloys are widely used in precision products such as electronic products, instruments and meters, and mechanical parts due to their excellent mechanical processing and electrical conductivity. In order to improve the flatness and decorative effect of copper alloys and ensure the final yield of products, chemical polishing is generally used. Chemical polishing has the characteristics of simple operation, energy saving, suitable for processing complex parts, and high production efficiency, so it is favored by people. After chemical polishing, the copper surface is very smooth and bright, showing the true color of copper, and even can make the copper surface produce mirror reflection. [0003] The formula of copper chemical polishing liquid is mainly divided int...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F3/06
CPCC23F3/06
Inventor 周家勤
Owner 惠州宇盛机械设备有限公司
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