Electrochemical treatment method of copper foil and composite copper foil material

A treatment method and electrochemical technology, applied in the direction of electrolytic organic material coating, etc., can solve the problems of slow reaction speed, carcinogenicity, toxicity, etc., and achieve the effects of good oxidation resistance, controllable process and high stability

Active Publication Date: 2020-05-26
QINGHAI INST OF SALT LAKES OF CHINESE ACAD OF SCI +1
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the hexavalent chromium ions present in dichromate are toxic and carcinogenic, which will have negative effects on the human body and the surrounding environment during operation and discharge
In order to avoid the damage of hexavalent chromium to the environment and human body, and reduce the environmental protection pressure of enterprises, many enterprises have begun to study the passivation process of copper foil without chromium, such as passivation based on tin, phytic acid or chitosan. These processes have more or less defects in some aspects, or they cannot achieve the same level of anti-corrosion and anti-oxidation effects as chromium-containing passivation, or the composition of the formula is too complicated, and it is difficult to determine the components in actual production. Stable control, or the reaction speed is too slow, it is difficult to meet the needs of rapid passivation treatment of the surface in the actual production of copper foil

Method used

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  • Electrochemical treatment method of copper foil and composite copper foil material
  • Electrochemical treatment method of copper foil and composite copper foil material
  • Electrochemical treatment method of copper foil and composite copper foil material

Examples

Experimental program
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Effect test

Embodiment 1

[0047] Plasma surface treatment is carried out on the copper foil. The discharge method is low-voltage capacitive coupling discharge. is 10W. Mix dodecyltrimethoxysilane with sulfuric acid solution and acetic acid solution, and hydrolyze at 5°C for 48 hours, wherein the volume ratio of dodecyltrimethoxysilane to the mixed solution is 12:100; Add sodium sulfate in the solution, obtain described electrolytic solution, wherein, the acid concentration in the electrolytic solution is 0.05mol / L, and the concentration of sodium sulfate in the electrolytic solution is 0.1g / L; In the passivation tank, use above-mentioned electrolytic solution, with The metal titanium plate covered with a protective coating is used as the anode, and the electrolytic current density is 2A / m 2 , the temperature of the bath solution is 70°C, the copper foil treated with the plasma surface enters the passivation tank through the transmission device, as the cathode of the electrochemical reaction, after the...

Embodiment 2

[0050] Plasma surface treatment is carried out on the copper foil. The discharge method is low-voltage capacitive coupling discharge. It is 400W. Mix dodecyltrimethoxysilane with hydrochloric acid solution and acetic acid solution, and hydrolyze at 60°C for 1 hour, wherein the volume ratio of dodecyltrimethoxysilane to the mixed solution is 90:100; Sodium sulfate is added in the solution to obtain the electrolyte, wherein the acid concentration in the electrolyte is 2mol / L, and the concentration of sodium sulfate in the electrolyte is 15g / L; in the passivation tank, use the above electrolyte to cover the surface The metal titanium plate with protective coating is used as the anode, and the electrolytic current density is 60A / m 2 , the temperature of the bath is 20°C, and the copper foil after plasma surface treatment enters the passivation bath through the transmission device as the cathode of the electrochemical reaction. After electrochemical treatment, after the copper fo...

Embodiment 3

[0052] Plasma surface treatment is carried out on the copper foil. The discharge method is low-voltage capacitive coupling discharge. It is 240W. Mix dodecyltrimethoxysilane with nitric acid solution and acetic acid solution, and hydrolyze at 25°C for 12 hours, wherein the volume ratio of dodecyltrimethoxysilane to the mixed solution is 20:100; Sodium sulfate is added in the solution to obtain the electrolyte, wherein the acid concentration in the electrolyte is 0.5mol / L, and the concentration of sodium sulfate in the electrolyte is 7g / L; A metal titanium plate covered with a protective coating is used as the anode, and the electrolytic current density is 10A / m 2 , the bath temperature is 50°C, the copper foil after plasma surface treatment enters the passivation tank through the transmission device, as the cathode of the electrochemical reaction, after electrochemical treatment, the copper foil leaves the passivation tank through the transmission device , a layer of silane ...

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Abstract

The invention discloses an electrochemical treatment method of copper foil and a composite copper foil material. The electrochemical treatment method comprises the following steps of jointly constructing an electrochemical reaction system by at least using a plasma surface-treated copper foil as the cathode, an anode and an electrolyte; and then electrifying the electrochemical reaction system toperform an electrochemical reaction, thereby forming a silane polymer film layer on the surface of the copper foil through polycondensation, wherein the electrolyte comprises a mixed solution of sodium sulfate, dodecyltrimethoxysilane and an acid solution. The plasma surface treatment and the electrochemical alkylation reaction have the advantages of fast reaction and controllable process, and canmeet the needs on rapid passivation treatment of the surface in the actual production of the copper foil; a silane polymer film generated through two-step treatment of the copper foil has high stability and high oxidation resistance; and at the same time, compared with the traditional chromium-containing passivation process, the method has the advantages of environmental protection and no pollution.

Description

technical field [0001] The invention belongs to the technical field of copper foil surface treatment, and in particular relates to an electrochemical treatment method for copper foil and a composite copper foil material. Background technique [0002] Without surface protection, the fresh surface of electrolytically generated copper foil is easily oxidized in the air. The surface treatment process of copper foil can effectively improve the oxidation resistance of copper foil, increase the storage time of copper foil, reduce the requirements for storage place of copper foil, and ensure that the quality of copper foil can meet the standard when it is used. [0003] The existing copper foil anti-corrosion and anti-oxidation surface treatment process can be divided into two types from the source of raw materials, namely, chromium passivation process and chromium-free passivation process. Among them, the chromium passivation process is the most widely used because of its good ant...

Claims

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Application Information

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IPC IPC(8): C25D9/02C25D5/34C25D7/06
CPCC25D9/02C25D5/34C25D7/0614
Inventor 张波冯海涛董亚萍许志榕李武王开林梁建徐慧云荀库李波郑竹林
Owner QINGHAI INST OF SALT LAKES OF CHINESE ACAD OF SCI
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